A3PE1500-1PQG208I

The A3PE1500-1PQG208I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology, offering a balance of logic density, on-chip memory and I/O capability in a 208-pin PQFP package. With 38,400 logic elements and approximately 276,480 bits of embedded memory, it is positioned for industrial applications that require reconfigurable logic with a wide operating temperature range and a compact surface-mount package.

Key Features

• Core Capacity  38,400 logic elements and 1,500,000 gates provide substantial programmable logic resources for mid-density FPGA designs.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 bits) to support buffering, state storage and small data structures without external memory.
• I/O Count  147 I/O pins enable extensive peripheral interfacing and system integration in a single device.
• Power Supply  Operates from a core voltage range of 1.425 V to 1.575 V, allowing predictable power planning for the FPGA core.
• Package & Mounting  Available in a 208-BFQFP / 208-PQFP (28 × 28 mm) package with surface-mount mounting for mainstream PCB assembly processes.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet temperature requirements for demanding environments.
• Manufacturing & Compliance  Supplied by Microchip Technology and RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control  Use the device for control logic and interface tasks that benefit from an industrial temperature range and extensive I/O.
• Communications & I/O Aggregation  Consolidate multiple interface functions using 147 I/O pins and on-chip memory for packet buffering or protocol bridging.
• Embedded Processing Offload  Implement custom accelerators or peripheral offloads using 38,400 logic elements and 1.5 million gates to reduce system-level CPU load.

Unique Advantages

• Balanced Logic Density: 38,400 logic elements deliver mid-range capacity for complex state machines, data-paths and control logic without overprovisioning.
• On-Chip Memory: Approximately 0.276 Mbits of embedded RAM supports local buffering and temporary data storage, reducing dependence on external memory.
• Extensive I/O: 147 available I/Os enable integration of sensors, interfaces and peripheral devices directly to the FPGA, simplifying board design.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in thermally challenging environments where reliability matters.
• Compact Surface-Mount Package: The 208-PQFP (28 × 28 mm) package provides a space-efficient footprint for systems requiring a balance of I/O and thermal performance.
• Clear Power Requirements: A defined core voltage window (1.425 V to 1.575 V) enables straightforward power-supply design and margining.

Why Choose A3PE1500-1PQG208I?

The A3PE1500-1PQG208I is suited to designers seeking a mid-density FPGA with a strong mix of logic resources, on-chip RAM and a high I/O count in a surface-mount 208-pin package. Its industrial temperature rating and RoHS compliance make it appropriate for applications where environmental robustness and regulatory conformity are important.

Backed by Microchip Technology, this device fits designs that require reconfigurable logic, moderate embedded memory and broad interfacing capability while maintaining predictable power and package requirements for production deployment.

Request a quote or contact sales to discuss pricing, availability and integration support for the A3PE1500-1PQG208I.