A3PE1500-1PQ208
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 181 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of A3PE1500-1PQ208 – ProASIC3E Field Programmable Gate Array (FPGA)
The A3PE1500-1PQ208 is a ProASIC3E family FPGA IC from Microchip Technology, provided in a 208-BFQFP package. It delivers a mid-range integration point with 38,400 logic elements, approximately 276,480 bits of embedded memory, and 147 I/O pins for commercial electronic designs.
Designed for commercial-grade embedded applications, the device balances on-chip logic capacity, embedded RAM, and a substantial I/O count in a surface-mount 208-pin package, with a core supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity 38,400 logic elements providing a programmable fabric suitable for medium-complexity designs; equivalent to 1,500,000 gates.
- Embedded Memory Approximately 0.276 Mbits (276,480 bits) of on-chip RAM to support buffering, state storage, and small LUT-based memories.
- I/O 147 user I/O pins for interfacing with peripherals, sensors, and external devices in compact systems.
- Power Core voltage supply specified from 1.425 V to 1.575 V to meet the device’s power requirements.
- Package and Mounting Surface-mount package: 208-BFQFP (supplier device package listed as 208-PQFP, 28×28 footprint) for PCB assembly in space-conscious designs.
- Operating Range Commercial-grade operating temperature from 0 °C to 85 °C for typical commercial electronics environments.
- Compliance RoHS compliant.
Typical Applications
- Commercial Embedded Systems Implements control logic, glue functions, and mid-level processing in consumer and commercial products that require reconfigurable hardware.
- Interface and Protocol Bridging Provides programmable I/O and logic to bridge between differing interfaces or to implement custom protocol handling.
- Test & Measurement Equipment Supports data capture, preprocessing, and control logic tasks in bench instruments and automated test gear.
- Communications Equipment (Commercial) Enables custom packet handling, buffering, and interface logic in commercial networking and communications devices.
Unique Advantages
- High Logic Density: 38,400 logic elements and 1,500,000 gates allow for complex finite-state machines, data paths, and control logic without external ASICs.
- On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces external memory needs for many buffering and state-storage tasks.
- Generous I/O: 147 I/O pins give flexibility for multiple peripherals, buses, and interface standards within a single device.
- Compact Surface-Mount Package: 208-pin BFQFP (208-PQFP, 28×28 footprint) supports dense PCB layouts while keeping component count low.
- Commercial Temperature and RoHS Compliance: Specified 0 °C to 85 °C operating range and RoHS compliance suit mainstream commercial product requirements.
- Controlled Core Voltage: Narrow core supply range (1.425 V–1.575 V) simplifies power-supply design for the programmable core.
Why Choose A3PE1500-1PQ208?
The A3PE1500-1PQ208 positions itself as a balanced ProASIC3E FPGA for commercial designers who need substantial logic resources, embedded RAM, and a high I/O count in a compact surface-mount package. Its combination of 38,400 logic elements, approximately 276,480 bits of on-chip RAM, and 147 I/Os makes it well suited to consolidate multiple functions into a single programmable device.
Manufactured by Microchip Technology and offered in a 208-pin BFQFP footprint, this FPGA is a practical choice for teams developing commercial electronics that require reconfigurable logic, moderate memory, and robust I/O capabilities while adhering to RoHS requirements and standard commercial temperature ranges.
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