A3PE1500-1FGG484I

The A3PE1500-1FGG484I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology, designed for industrial applications that require a balance of logic capacity, on-chip memory, and extensive I/O. With 38,400 logic elements and approximately 0.28 Mbits of embedded memory, this device targets embedded systems, industrial control, and designs that demand a high I/O count in a compact BGA package.

Key Features

• Core / Logic Elements  Provides 38,400 logic elements (cells) and approximately 1,500,000 gates to implement complex combinational and sequential logic.
• Embedded Memory  Includes 276,480 total RAM bits, approximately 0.28 Mbits of on-chip embedded memory for buffering, FIFOs, and state storage.
• I/O Capacity  Offers 280 general-purpose I/O pins to support wide peripheral and system interfacing requirements.
• Power Supply  Operates from a core voltage supply range of 1.425 V to 1.575 V, enabling predictable power planning for system design.
• Package  Available in a 484-ball BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor to save board area while delivering high pin density.
• Temperature & Grade  Rated for industrial use with an operating temperature range of −40 °C to 100 °C to meet demanding environmental conditions.
• Environmental Compliance  RoHS compliant to support regulated manufacturing and product lifecycles.

Typical Applications

• Industrial Control & Automation  Used to implement custom control logic, signal conditioning, and real-time decision-making in industrial systems where industrial-grade components and wide temperature range are required.
• Embedded Systems  Suitable for embedded designs that require moderate logic capacity and on-chip memory combined with a large number of I/Os for peripheral connectivity.
• Communications & Networking  Can be used for data path logic, protocol bridging, and I/O aggregation where substantial gate count and many I/Os are beneficial.
• Prototyping & Custom Logic  Useful for development and deployment of custom hardware accelerators, state machines, and glue logic that benefit from reprogrammability and a compact BGA package.

Unique Advantages

• High logic density: 38,400 logic elements and roughly 1.5 million gates enable implementation of complex digital functions without external gate arrays.
• Integrated on-chip memory: Approximately 0.28 Mbits of embedded RAM reduces dependence on external memory for buffering and control state.
• Large I/O complement: 280 I/Os simplify system integration by accommodating multiple peripherals, sensors, and buses directly on-chip.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh environments and industrial equipment.
• Compact, high-density package: 484-BGA (484-FPBGA, 23×23) surface-mount package delivers high pin count in a space-efficient footprint.
• Regulatory compliance: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose A3PE1500-1FGG484I?

The A3PE1500-1FGG484I offers a balanced combination of substantial logic resources, on-chip RAM, and a high I/O count in a compact 484-BGA package, making it well suited to industrial and embedded designs that require reliable operation across a wide temperature range. Its specified core voltage range and RoHS compliance make it straightforward to integrate into controlled manufacturing processes and predictable power architectures.

This device is ideal for designers and engineers building industrial control systems, communications interfaces, and custom embedded logic who need a reprogrammable solution with ample logic capacity and connectivity while maintaining a small board footprint and industrial-grade environmental tolerance.

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