A3PE1500-1FGG676

The A3PE1500-1FGG676 is a ProASIC3E field programmable gate array (FPGA) supplied in a 676-ball BGA package. It provides a programmable logic fabric with 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of on-chip RAM, combined with up to 444 I/O pins.

This device is targeted at designs that require substantial logic capacity and a high I/O count within a compact surface-mount 676-FBGA (27×27) package, while operating from a 1.425 V to 1.575 V supply and within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity  1,500,000 gates and 38,400 logic elements provide substantial programmable logic resources for mid- to large-scale digital designs.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM to support data buffering, state machines and small memory structures without external memory.
• High I/O Count  Up to 444 I/O pins enable dense external interfacing and support for multiple parallel buses or numerous peripherals.
• Package and Mounting  676-ball FBGA package (27×27) designed for surface-mount assembly to save PCB area while providing high pin density.
• Supply Voltage  Operates from 1.425 V to 1.575 V, allowing designers to plan power distribution and voltage rails accordingly.
• Operating Temperature and Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Regulatory Compliance  RoHS compliant for alignment with common environmental requirements.

Typical Applications

• Custom digital systems  Implement custom logic functions and state machines using the device’s 38,400 logic elements and 1,500,000 gates.
• High-density I/O interfaces  Support multiple parallel interfaces, sensor arrays or bus bridging with up to 444 I/O pins.
• Embedded control and glue logic  Replace discrete logic and microcontroller peripherals where inline programmable logic and on-chip RAM are beneficial.
• Prototyping and integration  Use the FPGA’s capacity and package density to consolidate functions during design validation and integration phases.

Unique Advantages

• High logic integration: 1,500,000 gates and 38,400 logic elements reduce the need for external ASICs or multiple discrete components.
• Large I/O resource: 444 available I/O pins enable complex interfacing without extensive board-level multiplexing.
• Compact, high-density package: 676-FBGA (27×27) delivers high pin count in a space-efficient surface-mount form factor.
• On-chip memory: Approximately 0.276 Mbits of embedded RAM supports buffering and local data storage, lowering external memory requirements.
• Environmentally compliant: RoHS compliance aligns the device with common environmental and manufacturing standards.
• Predictable operating envelope: Clearly specified supply voltage range (1.425 V–1.575 V) and commercial temperature rating (0 °C–85 °C) simplify system-level power and thermal planning.

Why Choose A3PE1500-1FGG676?

The A3PE1500-1FGG676 combines substantial logic and memory resources with a high I/O count in a compact 676-FBGA package, making it suitable for applications that require dense interface connectivity and significant programmable logic capacity. Its clearly defined supply voltage and commercial temperature range help streamline system power and thermal design decisions.

This device is a fit for engineers and procurement teams looking for a RoHS-compliant FPGA option that balances logic density, on-chip memory and I/O capability for embedded systems, interface-rich modules and consolidated digital designs.

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