A3PE1500-1PQ208I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 1,271 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of A3PE1500-1PQ208I – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP
The A3PE1500-1PQ208I is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology. It provides a fixed set of on-chip resources including 38,400 logic elements and approximately 0.276 Mbits of embedded memory to implement custom digital logic.
Packaged in a 208-pin BFQFP (supplier package: 208-PQFP, 28×28) with surface-mount mounting and an industrial operating temperature range, this device is suited to designs that require a mid-density, configurable logic solution with defined I/O and power characteristics.
Key Features
- Core Logic 38,400 logic elements (LEs) providing programmable digital resources and an estimated 1,500,000 equivalent gates for custom logic implementations.
- Embedded Memory Approximately 276,480 bits of on-chip RAM for buffering, FIFOs, and small data stores within user logic.
- I/O Resources 147 user I/O pins to support a range of external interfaces and parallel/serial connectivity within system constraints.
- Power Specified supply voltage range of 1.425 V to 1.575 V for the core power domain.
- Package & Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting for standard PCB assembly flows.
- Thermal & Environmental Industrial operating temperature range of −40 °C to 100 °C and RoHS-compliant construction.
Typical Applications
- Industrial Control Leverages the industrial temperature grade and 147 I/O for control logic, monitoring, and interface functions in factory automation and process control equipment.
- Embedded Logic and Glue Provides mid-density programmable logic for protocol bridging, custom I/O handling, and system glue in embedded systems.
- Instrumentation and Test Uses on-chip memory and logic elements to implement data buffering, control state machines, and timing-critical functions in measurement and test equipment.
Unique Advantages
- Significant Logic Capacity: 38,400 logic elements enable implementation of substantial custom digital functions without external ASICs.
- Integrated On-Chip Memory: Approximately 276,480 bits of embedded RAM reduce the need for external memory for many control and buffering tasks.
- Ample I/O Count: 147 user I/Os support a variety of external interfaces and mixed-signal front-ends while minimizing additional interface components.
- Industrial Temperature Rating: Specified operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compact Surface-Mount Packaging: 208-BFQFP (208-PQFP, 28×28) provides a balance of pin count and PCB footprint for space-constrained designs.
- Regulatory Compliance: RoHS-compliant construction supports environmental and regulatory requirements for many product lines.
Why Choose A3PE1500-1PQ208I?
The A3PE1500-1PQ208I positions itself as a mid-density, industrial-grade FPGA option within the ProASIC3E family from Microchip Technology, combining a substantial number of logic elements with embedded memory and a high I/O count. Its defined voltage and temperature ranges, together with a compact 208-pin package, make it suitable for designers seeking a configurable hardware building block with predictable electrical and thermal characteristics.
This device is well suited for teams building industrial control systems, embedded logic solutions, or instrumentation where on-chip resources, I/O availability, and industrial temperature operation are important selection criteria. Its combination of resources supports scalable designs and helps consolidate discrete logic functions into a single programmable device.
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