A3PE1500-2FG484

The A3PE1500-2FG484 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology, offered in a 484-ball BGA package. It provides a high-density, surface-mount FPGA option with 1,500,000 gates and 38,400 logic elements for designs that require substantial programmable logic and I/O resources.

Key device attributes include approximately 276,480 bits of on-chip RAM, up to 280 user I/O pins, a supply voltage range of 1.425 V to 1.575 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and supplied in a 484-FPBGA (23×23) package.

Key Features

• Core Logic  1,500,000 gates and 38,400 logic elements provide substantial programmable logic capacity for complex combinational and sequential functions.
• Embedded Memory  Approximately 0.276 Mbits (276,480 bits) of on-chip RAM to support buffering, state storage, and small data structures without external memory.
• Input/Output  Up to 280 user I/O pins enable broad interfacing options for peripherals, buses, and signal routing within system designs.
• Package  484-ball BGA in a 484-FPBGA (23×23) supplier package for compact board footprint and high pin count in a surface-mount form factor.
• Power  Operates from a core supply range of 1.425 V to 1.575 V, allowing designs to target this defined low-voltage domain.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Assembly & Compliance  Surface-mount mounting type and RoHS compliance for modern PCB assembly and environmental standards.

Typical Applications

• High-density programmable logic  Use where 1,500,000 gates and 38,400 logic elements are required to implement custom digital functions and control logic.
• I/O-rich interfaces  Suitable for designs that need up to 280 I/O pins for connecting multiple peripherals, buses, or signal domains.
• On-chip buffering and small data storage  Embedded RAM (approximately 0.276 Mbits) supports buffering, FIFOs, and small lookup tables without immediate external memory.

Unique Advantages

• High logic density: 1,500,000 gates and 38,400 logic elements provide capacity for complex custom logic, reducing the need for additional discrete logic chips.
• Significant I/O availability: Up to 280 user I/Os enable flexible system partitioning and multiple peripheral connections on a single device.
• Compact BGA package: 484-FPBGA (23×23) offers a high pin-count, space-efficient package for dense PCB layouts.
• Defined low-voltage operation: Core supply specified from 1.425 V to 1.575 V to match targeted power domains and regulator choices.
• RoHS compliant and surface-mount ready: Manufactured to meet environmental directives and optimized for standard surface-mount assembly processes.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to suit commercial and many industrial-adjacent environments.

Why Choose A3PE1500-2FG484?

The A3PE1500-2FG484 balances high programmable logic capacity, substantial I/O resources, and embedded RAM in a compact 484-BGA package. Its specified core voltage range and commercial temperature rating make it a defined option for system designs that require significant on-chip logic and I/O integration while adhering to surface-mount assembly and RoHS requirements.

This device is well suited to engineering teams and procurement looking for a high-density FPGA solution from Microchip Technology that delivers programmable capacity, ample I/O, and on-chip memory in a single component to simplify board-level design and reduce external component count.

Request a quote or submit a quote request to evaluate the A3PE1500-2FG484 for your next design.