A3PE1500-2FG484I

The A3PE1500-2FG484I is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology, provided in a 484-ball BGA package. It delivers a high-density, industrial-grade programmable logic option for embedded designs requiring substantial logic capacity and I/O density.

With 38,400 logic elements, approximately 0.28 Mbits of embedded memory, and 280 I/O pins, this device is suited to industrial embedded systems that require configurable hardware, robust operating range, and surface-mount packaging.

Key Features

• Core Capacity — 38,400 logic elements enabling complex user-defined digital logic and up to 1,500,000 equivalent gates for mid-to-high density designs.
• Embedded Memory — 276,480 total RAM bits (approximately 0.28 Mbits) for on-chip storage and buffering of data and state.
• I/O Density — 280 I/O pins to support multiple parallel interfaces, sensor arrays, and high-channel-count connectivity.
• Power — Supported core voltage range of 1.425 V to 1.575 V to match system power architectures.
• Package & Mounting — 484-FPBGA (23×23) footprint in a 484-BGA package, designed for surface-mount assembly.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS-compliant manufacturing status for environmental and regulatory alignment.

Typical Applications

• Industrial Embedded Systems — Implement custom control and processing logic in industrial environments leveraging the device's industrial-grade temperature range.
• High-Density I/O Systems — Support applications requiring large numbers of signal channels or parallel interfaces using 280 available I/Os.
• Embedded Logic and Glue — Replace or augment discrete logic with configurable, on-board programmable logic to consolidate functions and reduce BOM complexity.
• Compact Board Designs — Use the 484-FPBGA (23×23) package for compact, surface-mount deployments where board area and integration matter.

Unique Advantages

• High logic density: 38,400 logic elements and 1,500,000 equivalent gates provide capacity for substantial custom logic implementation.
• On-chip memory: Approximately 0.28 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• Extensive I/O: 280 I/Os enable flexible interfacing with sensors, peripherals, and parallel buses without extensive external glue logic.
• Industrial readiness: Rated to operate from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact BGA package: 484-FPBGA (23×23) supports high-density board integration and surface-mount assembly processes.
• Controlled core supply range: Narrow voltage supply window (1.425 V–1.575 V) helps ensure predictable core operation within system power designs.

Why Choose A3PE1500-2FG484I?

The A3PE1500-2FG484I offers a balance of logic capacity, on-chip memory, and high I/O count in a compact 484-BGA package, making it a strong candidate for industrial embedded designs that need configurable hardware and robust operating temperatures. Its specification set supports consolidation of discrete functions into programmable logic while providing predictable electrical and thermal characteristics.

Designed and manufactured by Microchip Technology, this device is appropriate for engineers and procurement teams seeking a mid-to-high density FPGA solution for industrial applications where integration, I/O breadth, and thermal capability are priorities.

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