A3PE1500-2FGG484I

The A3PE1500-2FGG484I is a ProASIC3E Field Programmable Gate Array (FPGA) IC featuring 1,500,000 gates and 38,400 logic elements. It integrates 280 user I/Os and approximately 0.276 Mbits of on-chip RAM in a compact 484‑BGA surface-mount package.

Designed for industrial applications, the device supports a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, providing a combination of integration density and environmental robustness for high-density logic and I/O requirements.

Key Features

• Core Logic  Provides 1,500,000 gates and 38,400 logic elements to implement complex custom logic and glue functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM for local buffering, state storage, and data path implementation.
• I/O Capacity  280 user I/Os to support rich external interfacing and parallel connectivity in a single device.
• Power Supply  Operates from a 1.425 V to 1.575 V supply range to match system power design requirements.
• Package and Mounting  484‑BGA (484‑FPBGA, 23×23) surface-mount package for high pin-count routing in compact board layouts.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet industrial deployment conditions.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Industrial Automation  Implement control logic and custom timing functions that require industrial temperature support and a dense logic resource pool.
• High‑density I/O Systems  Serve as a central programmable fabric where a large number of signals must be aggregated and managed, leveraging 280 I/Os.
• Data Buffering and Local Memory  Enable on-chip buffering and state machines using approximately 0.276 Mbits of embedded RAM for intermediate data storage.
• Compact, High‑pin‑count Designs  Fit into board designs that need many I/Os and logic in a compact 484‑BGA footprint for space-constrained applications.

Unique Advantages

• High logic capacity: 1,500,000 gates and 38,400 logic elements provide room for complex FPGA implementations without partitioning across multiple devices.
• Substantial I/O availability: 280 user I/Os reduce the need for external multiplexers or GPIO expanders, simplifying system design.
• On‑chip embedded memory: Approximately 0.276 Mbits of RAM supports local buffering and accelerates data-path operations.
• Industrial operation: Rated for −40 °C to 100 °C to support deployments in demanding environmental conditions.
• Compact BGA footprint: 484‑BGA surface-mount package enables high pin-count routing while conserving board area.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose A3PE1500-2FGG484I?

The A3PE1500-2FGG484I balances high logic density, ample I/O count, and onboard RAM in a compact 484‑BGA package, making it well suited for industrial designs that demand integration and environmental resilience. Its specified supply range and extended operating temperature support stable operation in deployed systems.

Choose this FPGA when your design requires consolidated programmable logic, significant I/O capability, and on-chip memory in a surface-mount form factor for long-term industrial deployment.

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