A3PE1500-2PQ208I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 191 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of A3PE1500-2PQ208I – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP
The A3PE1500-2PQ208I is a ProASIC3E FPGA from Microchip Technology offering a mid-density programmable logic solution. It provides 38,400 logic elements, approximately 0.276 Mbits of embedded memory and a gate count of 1,500,000 in a 208-pin BFQFP package.
Designed for industrial applications, this surface-mount device combines a high I/O count (147 I/Os), an industrial operating temperature range (−40 °C to 100 °C) and a defined core supply window (1.425 V to 1.575 V) to address control, interface and embedded logic requirements where predictable electrical and thermal behavior is required.
Key Features
- Core Logic 38,400 logic elements and approximately 1,500,000 gates provide the programmable resources for custom digital logic and control functions.
- Embedded Memory Total on-chip RAM of 276,480 bits, representing approximately 0.276 Mbits of embedded memory for buffering, FIFOs and small data stores.
- I/O Capacity 147 user I/Os to support multiple parallel interfaces, peripheral connections and board-level integration.
- Power and Voltage Specified core supply voltage range of 1.425 V to 1.575 V for controlled power design and system integration.
- Package and Mounting 208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount configuration for compact PCB designs.
- Industrial Temperature Grade Qualified for operation from −40 °C to 100 °C, suitable for industrial environments.
- RoHS Compliance Device is RoHS compliant to support lead-free manufacturing processes.
Typical Applications
- Industrial Control Implement custom control logic, I/O aggregation and real-time interfacing using the device’s logic elements and 147 I/Os within an industrial temperature window.
- Embedded Systems Provide glue logic, protocol bridging and peripheral control where on-chip RAM and moderate gate count meet embedded requirements.
- Communications & Interfaces Support custom interface logic and parallel/serial I/O arrangements leveraging the high I/O count and compact BFQFP package for board-level designs.
- Test & Measurement Implement deterministic digital processing and data buffering using embedded RAM and programmable logic for instrumentation and test applications.
Unique Advantages
- Balanced Integration: Combines 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 147 I/Os to reduce the need for external glue logic.
- Industrial Reliability: Rated for −40 °C to 100 °C operation, making it suitable for harsher environments and industrial deployments.
- Compact Surface-Mount Package: 208-BFQFP (28×28 PQFP footprint) enables dense PCB layouts while maintaining a high pin count.
- Predictable Power Envelope: Defined core supply range (1.425 V to 1.575 V) simplifies power-supply design and system integration.
- Compliance-Ready: RoHS compliance supports lead-free assembly and regulatory consistency for commercial products.
Why Choose A3PE1500-2PQ208I?
The A3PE1500-2PQ208I from Microchip Technology delivers a practical balance of programmable logic, embedded memory and I/O density in a surface-mount 208-pin package. Its industrial temperature rating and controlled core voltage range make it a suitable choice for engineers developing robust embedded and control systems that require deterministic digital logic and moderate memory resources.
This part is well suited to designers seeking a mid-density FPGA solution within the ProASIC3E family footprint, offering a clear specification set for board-level integration and RoHS-compliant production.
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