A3PE1500-FG484I

The A3PE1500-FG484I is a ProASIC3E field programmable gate array (FPGA) packaged in a 484-ball BGA. It provides a dense logic fabric with on-chip RAM and a broad I/O count in a compact surface-mount package. Designed for industrial environments, the device targets applications that require reconfigurable logic, moderate embedded memory, and a wide operating temperature range.

Key Features

• Logic Capacity  38,400 logic elements (cells) providing a total of 1,500,000 gates for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for local data buffering, state machines, and small lookup tables.
• I/O Density  280 user I/O pins to support multiple peripherals, parallel interfaces, and board-level signal routing.
• Power Supply  Core voltage support from 1.425 V to 1.575 V to match system power rails and maintain stable core operation.
• Package and Mounting  484-FPBGA (23 × 23) package in a 484-BGA footprint, optimized for surface-mount assembly and high-density PCB integration.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C for deployment in industrial and temperature-challenging environments.
• Standards Compliance  RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• Industrial Control  Use the device's 38,400 logic elements and industrial temperature range for control, sequencing, and interface logic in factory and process automation systems.
• I/O-Intensive Systems  Leverage 280 I/O pins for designs that require multiple parallel interfaces, sensor aggregation, or board-level interconnect logic.
• Embedded Logic and Prototyping  Employ the 1,500,000-gate capacity and on-chip RAM for custom digital implementations, hardware prototyping, and algorithm acceleration.
• Compact Board-Level Integration  The 484-FPBGA (23×23) package enables high-density placement and integration on space-constrained PCBs.

Unique Advantages

• Balanced Logic and Memory:  Combines 38,400 logic elements with approximately 0.276 Mbits of on-chip RAM to support a wide range of control and data-buffering requirements without external memory.
• High I/O Count:  280 available I/O pins simplify system partitioning and reduce the need for external I/O expanders.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation and supplied in a surface-mount BGA package suitable for robust industrial designs.
• Compact, High-Density Packaging:  484-FPBGA (23×23) package allows dense PCB layouts and efficient board-level integration.
• Regulatory Compatibility:  RoHS compliance supports lead-free manufacturing processes and regulatory requirements.

Why Choose A3PE1500-FG484I?

The A3PE1500-FG484I positions itself as a versatile FPGA option that balances logic capacity, embedded RAM, and high I/O count in a compact 484-BGA package. Its industrial temperature rating and RoHS compliance make it suitable for production environments that require durability and regulatory alignment.

This device is well suited for engineers and procurement teams seeking a reconfigurable silicon building block for industrial control, high-density I/O designs, and board-level integration where a 23×23 FPBGA package and defined core voltage range are required.

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