A3PE1500-FG676I

The A3PE1500-FG676I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of embedded memory in a 676-FBGA (27×27) surface-mount package.

With 444 user I/O pins, a supply range of 1.425 V to 1.575 V and an industrial operating temperature range of −40 °C to 100 °C, this device is aimed at designs that require substantial logic capacity, dense I/O and industrial-temperature operation.

Key Features

• Core Logic 1,500,000 gates and 38,400 logic elements provide the programmable fabric for complex digital functions.
• On‑Chip Memory Approximately 0.276 Mbits of embedded RAM for buffering, state machines and local data storage.
• I/O Density 444 user I/O pins support high‑pin-count interfacing and parallel connectivity in a single device.
• Power Operates from a supply range of 1.425 V to 1.575 V to match system power domains requiring this core voltage.
• Package & Mounting 676-FBGA (27×27) package in a surface-mount form factor for compact board integration.
• Industrial Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance RoHS compliant for alignment with common environmental requirements.

Typical Applications

• Industrial Control Implements control logic and I/O aggregation in automation equipment operating across industrial temperature ranges.
• High‑Density I/O Systems Supports systems that require large numbers of parallel interfaces or multi-channel connectivity.
• Embedded Processing Provides programmable logic and on‑chip RAM for custom data handling, protocol bridging and state machines.

Unique Advantages

• High Logic Capacity: 1,500,000 gates and 38,400 logic elements enable integration of complex digital functions into a single device, reducing board-level complexity.
• Large I/O Count: 444 user I/Os allow direct connection to multiple peripherals and parallel interfaces without additional I/O expanders.
• Compact BGA Package: 676-FBGA (27×27) offers a space-efficient footprint for high-density boards while maintaining a surface-mount assembly approach.
• Industrial Rated: Specified for −40 °C to 100 °C operation to meet industrial temperature requirements.
• Controlled Core Voltage: Narrow supply window (1.425 V–1.575 V) supports designs with defined core power domains.
• RoHS Compliant: Conforms to RoHS for environmental regulatory alignment.

Why Choose A3PE1500-FG676I?

The A3PE1500-FG676I delivers a balanced combination of substantial logic resources, embedded memory and a very high I/O count in a compact 676-FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require reliable operation across extended temperature ranges and adherence to environmental standards.

This device is well suited for engineers and procurement teams looking to consolidate multiple functions into a single programmable device, simplify board-level design, and support systems that demand higher pin counts and robust thermal performance.

Request a quote or contact sales to obtain pricing and availability for the A3PE1500-FG676I.