A3PE1500-FGG676I

The A3PE1500-FGG676I is a ProASIC3E family Field Programmable Gate Array (FPGA) IC from Microchip Technology, designed for industrial applications. It provides a high-density programmable fabric with a combination of logic, embedded memory, and a large I/O complement suitable for complex embedded and control applications.

This device targets designs that require substantial logic capacity and I/O integration while operating across an industrial temperature range and a defined low-voltage core supply.

Key Features

• Logic Capacity 38,400 logic elements delivering approximately 1,500,000 gates for implementing complex digital functions and custom logic.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) for buffering, state storage, and small data tables.
• I/O Resources 444 user I/O pins to support wide interfacing needs and high-density external connectivity.
• Core Voltage Operates from a defined supply range of 1.425 V to 1.575 V to match system power rails and ensure predictable core behavior.
• Package & Mounting 676-FBGA (27 × 27) supplier package in a 676-BGA case, surface-mount mounting type for compact PCB integration.
• Industrial Temperature Range Rated for operation from -40 °C to 100 °C, supporting deployment in industrial environments.
• Environmental Compliance RoHS compliant, meeting common requirements for lead-free assembly and regulatory compatibility.

Typical Applications

• Industrial Control Use in control systems and PLCs where the industrial temperature range and high logic capacity enable reliable, compact custom logic implementations.
• Communications Infrastructure Suitable for protocol handling, data multiplexing, and interface bridging thanks to its high I/O count and programmable resources.
• Test & Measurement Ideal for custom signal processing, timing control, and instrumentation logic that require deterministic programmable logic and embedded RAM.
• Embedded Systems Integrates large logic arrays and multiple I/Os for system glue logic, peripheral interfacing, and custom accelerators in embedded platforms.

Unique Advantages

• High-density logic integration: 38,400 logic elements and 1.5 million gates provide the capacity to consolidate multiple discrete functions into a single FPGA.
• Significant I/O capability: 444 user I/Os reduce the need for external multiplexers or expanders in high-channel-count designs.
• Compact, industry-standard package: 676-FBGA (27 × 27) package enables high pin-count in a compact footprint for space-constrained PCBs.
• Industrial reliability: Specified operation from -40 °C to 100 °C and industrial grade classification suit deployments in harsh environments.
• Low-voltage core compatibility: 1.425 V to 1.575 V supply range aligns with modern low-voltage power architectures.
• RoHS compliant: Facilitates lead-free manufacturing and regulatory compliance for many production workflows.

Why Choose A3PE1500-FGG676I?

The A3PE1500-FGG676I delivers a balance of high logic density, substantial I/O, and embedded memory in a compact 676-BGA package, making it well suited for industrial and embedded designs that require consolidated programmable logic. Its specified operating voltage and industrial temperature rating provide predictable integration into systems with defined power and environmental constraints.

Designed by Microchip Technology as part of the ProASIC3E family, this device fits use cases where designers need robust, high-density programmable resources and compliance with common environmental requirements. Its combination of logic elements, on-chip RAM, and I/O count provides a scalable platform for complex digital designs.

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