A3PE1500-PQG208
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 300 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of A3PE1500-PQG208 – ProASIC3E FPGA, 147 I/O, 276,480-bit RAM, 208-BFQFP
The A3PE1500-PQG208 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high gate count and a substantial number of logic elements suitable for commercial embedded designs that require programmable digital logic and flexible I/O.
Designed for commercial-grade applications, this FPGA combines 1,500,000 gates, 38,400 logic elements and on-chip memory to support complex control, interfacing and signal processing tasks while operating within standard commercial temperature and voltage ranges.
Key Features
- Core Logic 1,500,000 gates and 38,400 logic elements provide capacity for complex digital functions and custom hardware implementations.
- Embedded Memory Approximately 0.276 Mbits (276,480 bits) of on-chip RAM for data buffering, state storage and small LUT-based memory structures.
- I/O Density 147 general-purpose I/Os to interface with peripherals, sensors, and board-level signals.
- Power Supply Specified supply voltage range from 1.425 V to 1.575 V to match precise core-voltage requirements.
- Package & Mounting Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for board-level integration and automated assembly.
- Operating Range Commercial operating temperature range of 0 °C to 85 °C suitable for a wide range of commercial-electronics environments.
- RoHS Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Commercial Embedded Systems — Implement custom control logic, protocol bridging or user-interface handling in commercial products that require programmable hardware.
- Communications Equipment — Provide flexible I/O and on-chip logic for protocol adaptation, framing or data path control in communication modules.
- Consumer Electronics — Enable feature-rich control and interface functions where a commercial temperature grade and compact PQFP package are appropriate.
- Prototyping and Development — Use the device’s large logic capacity and memory for evaluating and validating hardware-accelerated functions in commercial projects.
Unique Advantages
- High Logic Capacity: 1,500,000 gates and 38,400 logic elements provide headroom for complex designs and multi-function implementations.
- Integrated On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for small buffering and state storage.
- Generous I/O Count: 147 I/Os support broad interfacing needs without immediate need for additional GPIO expanders.
- Commercial Temperature and RoHS Compliance: Operates across 0 °C to 85 °C and meets RoHS requirements for mainstream commercial applications.
- Board-Level Friendly Package: 208-PQFP (28×28) surface-mount package simplifies PCB layout and supports automated assembly processes.
Why Choose A3PE1500-PQG208?
The A3PE1500-PQG208 positions itself as a capable commercial-grade FPGA option for designs that require substantial programmable logic, embedded memory, and a high count of I/Os in a board-friendly PQFP package. Its combination of gate density, logic elements and on-chip RAM supports implementation of complex control, interfacing and data-path tasks while operating within defined commercial voltage and temperature ranges.
Targeted at engineers and procurement teams building commercial embedded products, the device delivers scalability and integration to streamline BOMs and consolidate functions into a single, programmable component from Microchip Technology’s ProASIC3E family.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the A3PE1500-PQG208.

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