A3PE3000-1FG484

The A3PE3000-1FG484 is a Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial electronics requiring significant programmable logic and I/O density. It integrates 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 341 user I/Os in a 484-ball BGA package to address complex glue-logic, control and interface functions.

With a 1.425 V to 1.575 V core supply range, surface-mount 484-FPBGA (23×23) package, and commercial temperature rating (0 °C to 85 °C), this device targets mid- to high-density FPGA roles where platform integration, compact packaging, and RoHS compliance are important.

Key Features

• Logic Capacity 75,264 logic elements (cells) and around 3,000,000 logic gates to implement sizeable custom logic, state machines, and data-paths.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables without external memory.
• I/O Density 341 user I/Os to support wide parallel interfaces, multiple peripherals, or mixed-signal I/O arrangements.
• Power Core voltage supply range of 1.425 V to 1.575 V for predictable power budgeting in system designs.
• Package & Mounting 484-BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB layouts and high pin-count interconnect.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for a broad set of commercial and industrial-adjacent applications.
• Environmental Compliance RoHS compliant to support environmentally conscious manufacturing and assembly processes.

Typical Applications

• Embedded Control — Implement custom control logic and state machines using the device’s 75,264 logic elements and on-chip RAM for compact, integrated control solutions.
• Interface Bridging — Use the 341 I/Os to bridge multiple peripheral buses and custom interfaces in compact systems, reducing external glue components.
• Data Acquisition and Buffering — Leverage embedded RAM for temporary data storage and streaming buffers in acquisition or preprocessing tasks.

Unique Advantages

• High Logic Density: 75,264 logic elements enable substantial digital design implementation without pushing to larger-package alternatives.
• Significant I/O Count: 341 user I/Os reduce the need for external multiplexers and I/O expanders, simplifying board-level design.
• Integrated On-Chip Memory: Approximately 0.516 Mbits of embedded RAM supports local buffering and reduces dependency on external memory devices.
• Compact BGA Packaging: 484-FPBGA (23×23) provides high pin count in a space-efficient surface-mount form factor for dense PCBs.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C to meet the environmental range of many commercial deployments.
• RoHS Compliant: Meets common environmental regulations for modern electronics manufacturing.

Why Choose A3PE3000-1FG484?

The A3PE3000-1FG484 positions itself as a high-density, commercially graded FPGA option within Microchip Technology’s portfolio, offering a balance of logic capacity, on-chip memory, and extensive I/O in a compact 484-BGA package. Its specified core voltage range and RoHS compliance make it suitable for designers prioritizing predictable power integration and environmental compliance.

This device is well suited to teams developing commercial embedded systems that require substantial programmable logic, flexible I/O mapping, and on-chip RAM for buffering or LUT-based functions. Its combination of resources helps reduce external component count and supports scalable, reliable designs backed by a recognized semiconductor manufacturer.

Request a quote or submit an inquiry to receive pricing and availability information for the A3PE3000-1FG484 and to discuss how it fits your next design.