A3PE3000-1FG484I

The A3PE3000-1FG484I is a ProASIC3E field programmable gate array (FPGA) offered in a 484-ball BGA package. It provides a high-density, reprogrammable logic fabric with a large I/O count and embedded memory, targeted for industrial-grade embedded and control designs.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 341 I/O, this device supports complex logic integration while operating across an industrial temperature range and a defined core voltage window.

Key Features

• Logic Capacity  75,264 logic elements provide substantial programmable logic resources for complex designs and large-scale state machines.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for data buffering, FIFOs and small lookup tables.
• I/O Count  341 user I/O pins suitable for interfacing multiple peripherals, sensors and external devices.
• Gate Count  3,000,000 gates of configurable logic to support a wide range of combinational and sequential functions.
• Power  Specified core supply range of 1.425 V to 1.575 V for the device core power domain.
• Package & Mounting  484-ball FPBGA (23 × 23) package, surface-mount mounting type, enabling a compact board footprint.
• Temperature & Grade  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance  RoHS-compliant construction to meet environmental and materials requirements.

Typical Applications

• Industrial Control  Leverages industrial temperature rating and 341 I/O for sensor, actuator and fieldbus interfacing in control systems.
• Embedded Logic and Glue  Uses the 75,264 logic elements and 3,000,000 gates to implement custom glue logic, protocol bridging and peripheral control.
• Data Buffering and Small Memory Functions  Employs approximately 0.516 Mbits of embedded RAM for buffering, FIFOs and temporary storage in embedded designs.

Unique Advantages

• High Logic Density: 75,264 logic elements allow integration of complex functions into a single FPGA device, reducing system component count.
• Substantial I/O Availability: 341 user I/O pins accommodate multiple interfaces and peripherals without external multiplexing.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM provides local data storage for buffering and state retention.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact BGA Footprint: 484-FPBGA (23 × 23) package enables high-density PCB layouts while supporting surface-mount assembly.
• RoHS Compliant: Built to meet RoHS environmental material standards.

Why Choose A3PE3000-1FG484I?

The A3PE3000-1FG484I positions itself as a high-capacity, industrial-grade FPGA option that combines a large logic element count, meaningful on-chip RAM and a high I/O count in a compact 484-BGA footprint. Its specified core voltage range and industrial temperature rating make it suitable for embedded and control applications that require reliable operation across a wide thermal range.

Designers seeking to consolidate logic, manage multiple I/O domains and maintain a compact PCB layout will find the device suited to mid- to high-complexity FPGA implementations where long-term availability and RoHS compliance are important considerations.

Request a quote or submit an inquiry to get pricing and availability for the A3PE3000-1FG484I.