A3PE3000-1FGG324I

The A3PE3000-1FGG324I is a Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial applications that require reconfigurable digital logic. It combines high logic density, on-chip embedded memory, and a large I/O count in a compact 324-ball BGA package for space-efficient system integration.

Key Features

• Core Logic 75,264 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 bits) to support buffering, state storage, and small data structures directly in the FPGA fabric.
• Gate Count 3,000,000 gates enabling implementation of wide combinational and sequential logic functions.
• I/O Density 221 I/O pins to support diverse peripheral connections and multi-channel interfaces.
• Power Narrow core supply range of 1.425 V to 1.575 V for defined operating conditions.
• Package & Mounting 324-BGA (supplier device package: 324-FBGA, 19×19) in a surface-mount format for compact board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to address industrial environmental requirements.
• Environmental Compliance RoHS compliant for regulatory environmental considerations.

Typical Applications

• Industrial Control — Reconfigurable logic for control systems and automation where industrial temperature operation and reliable I/O are required.
• Interface Bridging — Protocol conversion and glue-logic between high‑pin-count peripherals and processors using available I/Os and programmable logic.
• Signal Processing — Implement medium-scale data-paths and buffering using the device's logic elements and on-chip memory.
• Embedded Systems — Compact implementation of custom digital functions in space-constrained, surface-mount designs.

Unique Advantages

• High-density programmable logic: 75,264 logic elements and 3,000,000 gates enable implementation of complex digital functions without external ASICs.
• Substantial on-chip memory: Approximately 0.52 Mbits of embedded RAM reduces reliance on external memory for moderate buffering and state retention.
• Large I/O count: 221 I/O pins support multi-channel interfaces and flexible board-level connectivity.
• Compact BGA footprint: 324-BGA (324-FBGA, 19×19) enables high-density PCB layouts and surface-mount assembly.
• Industrial-rated operation: −40 °C to 100 °C temperature range makes the device suitable for many industrial environments.
• Defined core supply range: Tight 1.425 V–1.575 V supply requirement supports predictable power design and regulation.

Why Choose A3PE3000-1FGG324I?

The A3PE3000-1FGG324I from Microchip Technology delivers a balanced combination of logic capacity, embedded memory, and high I/O density in a compact BGA package tailored for industrial applications. Its specified operating temperature range and surface-mount 324-BGA footprint make it suitable for space-constrained, ruggedized electronic designs that need reconfigurable logic.

This device is a practical choice for engineers designing medium- to high-density programmable logic solutions who require deterministic supply requirements, substantial on-chip resources, and compliance with RoHS environmental standards.

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