A3PE3000-1FGG896I

The A3PE3000-1FGG896I is a ProASIC3E field programmable gate array (FPGA) offered in an industrial-grade, surface-mount 896-BGA package. It provides substantial on-chip logic and memory resources together with a high I/O count for dense, reconfigurable designs.

This device is suited for industrial applications that require a combination of logic capacity, embedded memory and wide I/O availability while operating across a broad temperature and supply range.

Key Features

• Logic Capacity  Approximately 75,264 logic elements (logic cells) and a device gate count of 3,000,000 provide significant resource density for complex designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) for data buffering, state storage and local memory needs.
• I/O Resources  620 device I/O pins support designs requiring extensive external interfacing and parallel connectivity.
• Power Supply  Operates from a 1.425 V to 1.575 V core supply range for defined power planning and system integration.
• Package & Mounting  Supplied in an 896-BGA / 896-FBGA (31x31) package in a surface-mount form factor for compact PCB implementations.
• Operating Range  Rated for −40 °C to 100 °C operation to meet industrial thermal requirements.
• Regulatory/Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Industrial control systems  Leverage the device’s industrial grade rating, high logic element count and abundant I/O for configurable control and automation tasks.
• Embedded processing and glue logic  Use on-chip memory and logic resources to implement custom peripherals, protocol bridges and data handling functions.
• Communications and I/O aggregation  High I/O capacity supports aggregation, buffering and interface consolidation in communication-oriented equipment.

Unique Advantages

• High integration density: 75,264 logic elements and 3,000,000 gates allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• On-chip memory for local data handling: Approximately 0.516 Mbits of embedded RAM provides local storage for buffering and state machines without external memory.
• Extensive external interfacing: 620 I/O pins enable direct connection to a wide array of peripherals and buses, minimizing the need for additional interface components.
• Industrial-capable thermal range: Rated from −40 °C to 100 °C to support deployment in demanding temperature environments.
• Compact BGA package: 896-BGA / 896-FBGA (31x31) packaging delivers high pin density in a surface-mount form factor, aiding PCB space optimization.
• RoHS compliance: Conforms to environmental regulations for lead-free assembly and compliant manufacturing processes.

Why Choose A3PE3000-1FGG896I?

The A3PE3000-1FGG896I positions itself as a robust choice for industrial FPGA applications that require a balance of logic density, embedded memory and high I/O availability. Its specified operating temperature range, controlled core supply window and RoHS compliance make it suitable for long-term deployment in industrial environments.

This part is well suited to engineers and procurement teams looking to consolidate functionality, simplify board-level design and maintain environmental compliance while leveraging a high-density FPGA footprint in an 896-BGA package.

Request a quote or submit an inquiry for the A3PE3000-1FGG896I to discuss pricing, availability and lead times for your next design.