A3PE3000-1PQ208I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP |
|---|---|
| Quantity | 1,463 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of A3PE3000-1PQ208I – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP
The A3PE3000-1PQ208I from Microchip Technology is a ProASIC3E field programmable gate array optimized for industrial embedded applications. It provides high logic density and a broad set of on-chip resources in a 208-pin BFQFP surface-mount package.
With 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 147 I/Os, this device is suited for designs that require compact, high-capacity programmable logic operating across an industrial temperature range.
Key Features
- Core Logic 3,000,000 gates implemented as 75,264 logic elements to support complex digital functions and parallel processing.
- Embedded Memory Total on-chip RAM of 516,096 bits (approximately 0.516 Mbits) for buffering, state storage and local data handling.
- I/O Capacity 147 general-purpose I/Os to support multiple external interfaces and high pin-count connectivity.
- Power Operate with a core supply voltage range of 1.425 V to 1.575 V for defined power planning and supply design.
- Package & Mounting 208-BFQFP (208-PQFP, 28×28) surface-mount package for board-level integration in space-constrained assemblies.
- Temperature & Grade Industrial grade device with specified operating temperature range from −40°C to 100°C for robust field deployment.
Typical Applications
- Industrial Control Use in factory automation and process control systems where industrial temperature range and reliable programmable logic are required.
- Embedded Systems High logic density and on-chip memory make the device suitable for compact embedded controllers and compute subsystems.
- I/O-Intensive Interfaces Large I/O count supports applications that need extensive external peripheral and sensor connectivity.
- Signal Processing & Control Leverage the available logic elements and embedded RAM for deterministic control loops and data handling tasks.
Unique Advantages
- High logic integration: 3,000,000 gates and 75,264 logic elements provide capacity for substantial digital functionality within a single device.
- On-chip memory available: Approximately 0.516 Mbits of RAM reduces external memory requirements and simplifies board-level design.
- Generous I/O count: 147 I/Os enable flexible interfacing to peripherals, sensors and other system components without additional expansion.
- Industrial operating range: Specified −40°C to 100°C temperature rating supports deployment in demanding environments.
- Compact surface-mount package: 208-BFQFP (28×28) package balances high pin count with board space efficiency for embedded assemblies.
- Defined core voltage window: 1.425 V to 1.575 V supply range aids predictable power supply design and stability.
Why Choose A3PE3000-1PQ208I?
The A3PE3000-1PQ208I delivers a combination of high logic capacity, embedded memory and extensive I/O in a robust industrial-grade FPGA package. Its specification set is targeted at engineers designing compact, high-functionality embedded and industrial systems that demand predictable operating conditions and significant on-chip resources.
This device is well suited to projects that require scalable programmable logic with a reliable temperature range and a compact surface-mount footprint, offering a clear path to integrate substantial digital functions while minimizing external components.
Request a quote or submit a purchase inquiry today to evaluate the A3PE3000-1PQ208I for your next embedded or industrial design project.

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