A3PE3000-1PQG208I

The A3PE3000-1PQG208I is a ProASIC3E field programmable gate array (FPGA) IC designed for embedded logic implementations requiring substantial logic capacity and on-chip memory. It provides 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and up to 147 general-purpose I/O pins in a surface-mount 208-pin package.

With a 3,000,000-gate design, industrial-grade qualification, a 1.425 V to 1.575 V core supply window, and an operating temperature range of −40 °C to 100 °C, this device is specified for robust deployments where logic density, I/O count and controlled-voltage operation are key considerations.

Key Features

• Core Logic 75,264 logic elements supporting complex programmable logic implementations and up to 3,000,000 gates for large-scale designs.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for local data buffering and state storage within logic fabrics.
• I/O Capability 147 available I/O pins to support multiple external interfaces and parallel connections.
• Power Supply Specified core supply voltage of 1.425 V to 1.575 V to match designers’ low-voltage power architectures.
• Package and Mounting 208-BFQFP package case, supplier device package listed as 208-PQFP (28×28), designed for surface-mount assembly.
• Industrial Grade and Temperature Range Industrial-grade device with an operating temperature range from −40 °C to 100 °C for extended-environment applications.
• RoHS Compliance RoHS compliant for use in lead-free and environmentally conscious production processes.

Typical Applications

• Custom logic and control systems — Implement medium-to-large scale programmable logic for control, glue-logic, and processing tasks using the device’s 75,264 logic elements and 147 I/Os.
• Embedded memory buffering — Use the approximately 0.516 Mbits of on-chip RAM for small data stores, FIFOs or state tables local to the logic fabric.
• I/O-dense designs — Leverage 147 I/Os in applications requiring multiple parallel connections or aggregated signal interfacing in a single package.

Unique Advantages

• High logic capacity: 75,264 logic elements and 3,000,000 gates enable implementation of substantial programmable logic without offloading to external devices.
• On-chip memory available: Approximately 0.516 Mbits of embedded RAM reduces dependency on external memory for moderate buffering and storage needs.
• Significant I/O count: 147 I/Os allow flexible interfacing and consolidation of multiple signals in one FPGA package.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in extended-temperature environments.
• Compact surface-mount package: 208-BFQFP / 208-PQFP (28×28) offers a high-pin-count footprint suitable for PCB assembly workflows.
• RoHS compliant: Meets lead-free manufacturing and environmental requirements for modern production lines.

Why Choose A3PE3000-1PQG208I?

The A3PE3000-1PQG208I provides a balance of logic density, embedded memory, and I/O capacity in an industrial-grade FPGA package. Its combination of 75,264 logic elements, roughly 0.516 Mbits of on-chip RAM, and 147 I/Os makes it well suited for designers who need substantial programmable logic and local memory in a single, surface-mount device.

Engineers selecting this device benefit from a defined core voltage range and a wide operating temperature window, enabling robust, repeatable designs for applications where logic integration, thermal resilience, and RoHS compliance are priorities.

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