A3PE3000-2FG324

The A3PE3000-2FG324 is a commercial-grade ProASIC3E field programmable gate array (FPGA) in a 324-ball BGA package. It provides a configurable logic fabric with a high count of logic elements, embedded memory, and I/O to support a wide range of digital designs.

Key on-device resources include 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 221 user I/O and a logic capacity of 3,000,000 gates, all delivered in a 324-FBGA (19×19) surface-mount package with a 1.425 V to 1.575 V supply range and a commercial operating temperature of 0 °C to 85 °C.

Key Features

• Core Logic  75,264 logic elements providing a hardware fabric capable of implementing complex digital functions across up to 3,000,000 gates.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for buffer, FIFO and state storage requirements directly within the FPGA fabric.
• I/O Count  221 user I/O pins to support parallel interfaces, control signals and board-level connectivity needs.
• Package & Mounting  324-FBGA (19×19) package, surface-mount mounting type, suitable for dense PCB integration.
• Power  Operating supply range of 1.425 V to 1.575 V to match targeted system power domains.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Custom digital logic and control  Implement complex state machines, protocol engines and glue logic using 75,264 logic elements and 3,000,000 gates of capacity.
• Data buffering and small-memory functions  Utilize approximately 0.516 Mbits of embedded memory for FIFOs, lookup tables and temporary storage.
• High-pin-count I/O designs  Leverage 221 user I/O signals for multi-channel interfaces, parallel buses and board-level signal routing.

Unique Advantages

• High logic density: 75,264 logic elements and 3,000,000 gates allow implementation of substantial digital functions without external ASICs.
• Integrated embedded memory: Approximately 0.516 Mbits of on-chip RAM reduces dependence on external memory for small buffering and state storage.
• Large I/O budget: 221 user I/Os simplify system integration by accommodating multiple interfaces and peripherals directly on-chip.
• Compact BGA footprint: 324-FBGA (19×19) package enables dense board-level designs while supporting surface-mount assembly.
• Commercial-grade suitability: Specified for 0 °C to 85 °C operation to meet standard commercial application environments.
• RoHS compliant: Conforms to common environmental directives for lead-free assembly and distribution.

Why Choose A3PE3000-2FG324?

The A3PE3000-2FG324 delivers a balanced combination of logic density, embedded memory and I/O count in a compact 324-FBGA package, making it well suited for commercial FPGA applications that require substantial on-chip resources. Its defined supply voltage range and commercial temperature grading provide predictable integration into standard system power and thermal envelopes.

This device is a practical choice for designers seeking a programmable solution with significant gate and logic element capacity, on-chip memory for local buffering, and a high number of I/O signals to simplify board-level interfacing, all while meeting RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability for the A3PE3000-2FG324. Our team can provide lead-time and ordering information to support your design schedule.