A3PE3000-2FG484I

The A3PE3000-2FG484I is a ProASIC3E Field Programmable Gate Array (FPGA) designed for industrial applications that require programmable logic, high I/O density and on-chip memory. It combines a high gate count, substantial embedded memory and a wide operating temperature range to support robust embedded and industrial designs.

Key Features

• Programmable Logic Density — 3,000,000 gates and 75,264 logic elements provide significant capacity for complex logic implementation and custom hardware functions.
• Embedded Memory — Approximately 516,096 bits of on-chip RAM for buffering, data storage and intermediate processing without external memory.
• I/O Capability — 341 user I/O pins support high-density interfacing to sensors, peripherals and external systems.
• Power Supply — Specified core voltage range of 1.425 V to 1.575 V to match system power rails and enable predictable operation.
• Package and Mounting — Surface-mount 484-ball FPBGA (484-BGA, 23 × 23) package for compact board-level integration.
• Industrial Temperature Rating — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Compliance — RoHS-compliant construction for lead-free manufacturing processes.

Typical Applications

• Industrial Control — Implement custom control logic and I/O aggregation in industrial automation systems that require industrial temperature support.
• Embedded Systems — Integrate programmable logic and on-chip memory for prototype or production embedded designs with high I/O needs.
• Communications — Provide flexible protocol handling and interface bridging where dense I/O and programmable logic are required.
• Test & Measurement — Realize custom signal processing and data capture logic using abundant gates and embedded RAM for buffering.

Unique Advantages

• High logic capacity: 3,000,000 gates and 75,264 logic elements enable implementation of substantial logic functions on a single device, reducing external component count.
• Ample on-chip RAM: Approximately 516,096 bits of embedded memory support buffering and local data storage to simplify system memory architecture.
• Extensive I/O: 341 I/O pins accommodate complex board-level interfacing without resorting to multiple devices.
• Industrial-grade operation: −40 °C to 100 °C rating supports deployment in industrial environments with wider temperature requirements.
• Compact BGA package: 484-ball FPBGA (23 × 23) enables high-density PCB designs while maintaining robustness for surface-mount assembly.
• RoHS compliance: Supports lead-free manufacturing and environmental requirements.

Why Choose A3PE3000-2FG484I?

The A3PE3000-2FG484I positions itself as a high-density, industrial-grade FPGA option for designers who need significant programmable logic, on-chip memory and a large number of I/O in a compact surface-mount package. Its specified voltage range and wide operating temperature make it suitable for demanding embedded and industrial applications that require reliable, long-term operation.

For teams developing complex control, data acquisition or protocol-processing systems, this part offers integration and scalability that can reduce bill-of-materials and simplify board-level design, supported by a RoHS-compliant package suitable for modern manufacturing processes.

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