A3PE3000-2FG896I

The A3PE3000-2FG896I is a ProASIC3E field programmable gate array from Microchip Technology. This industrial-grade FPGA provides a high density of logic elements, substantial on-chip memory, and a large I/O complement in a compact 896-BGA surface-mount package.

Designed for systems that require significant programmable logic capacity, the device delivers 75,264 logic elements (approximately) and roughly 0.52 Mbits of embedded memory, along with an extended operating temperature range and RoHS compliance for regulated markets.

Key Features

• Logic Capacity  Approximately 75,264 logic elements supporting up to 3,000,000 gates for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density  Up to 620 I/O pins to support wide parallel interfaces and extensive external connectivity.
• Package and Mounting  896-BGA package (supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for high-density board integration.
• Power  Specified core supply range of 1.425 V to 1.575 V for compatibility with targeted system power architectures.
• Operating Range and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant for environmental regulatory requirements.

Typical Applications

• Industrial Control  Use the industrial temperature rating and robust logic capacity for control systems and factory automation requiring reliable programmable logic.
• High-Density I/O Systems  Leverage up to 620 I/Os for designs that require broad parallel interfacing or multiple peripheral connections in a single FPGA.
• Compact Board Designs  The 896-FBGA (31×31) package and surface-mount mounting make the device suitable for space-constrained PCBs where board real estate is limited.
• Embedded Logic and Processing  Deploy the device where approximately 75,264 logic elements and 3,000,000 gates are needed to implement custom datapaths, state machines, or glue logic.

Unique Advantages

• High Logic Density: Approximately 75,264 logic elements and 3,000,000 gates allow implementation of sizable logic functions within a single device, reducing system complexity.
• Substantial On-Chip Memory: Approximately 0.52 Mbits of embedded RAM provides local storage for buffers and intermediate processing without external memory.
• Extensive I/O Count: Up to 620 I/Os enable broad connectivity options and reduce the need for additional interface components.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C, the device supports deployments in demanding thermal environments.
• Compact, High-Density Packaging: The 896-FBGA (31×31) surface-mount package enables dense PCB integration while maintaining a large pin count.
• Regulatory Compliance: RoHS compliant construction supports environmental and regulatory requirements for many markets.

Why Choose A3PE3000-2FG896I?

The A3PE3000-2FG896I balances high logic element count, significant on-chip memory, and an extensive I/O complement in an industrial-grade FPGA package. Its specified core voltage range and surface-mount 896-FBGA package make it suitable for designs that require dense integration and reliable operation across extended temperatures.

Engineers and procurement teams looking for a Microchip Technology FPGA with ample logic resources, broad connectivity, and industrial temperature capability will find this device appropriate for mid- to high-complexity programmable logic applications where long-term availability and RoHS compliance are required.

Request a quote or submit an inquiry to receive pricing and availability for the A3PE3000-2FG896I.