A3PE3000-2FGG484I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA |
|---|---|
| Quantity | 461 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 341 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of A3PE3000-2FGG484I – ProASIC3E Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA
The A3PE3000-2FGG484I is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology designed for industrial applications. It delivers a high logic density with 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and a large 341-pin I/O count, enabling complex system integration in a single device.
Key Features
- Core Logic: 75,264 logic elements supporting designs with up to 3,000,000 gates for complex digital implementations.
- Embedded Memory: Approximately 0.516 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
- I/O Capacity: 341 general-purpose I/O pins to accommodate dense peripheral and bus interfacing requirements.
- Power (Supply): Operates from a core voltage supply of 1.425 V to 1.575 V, suitable for controlled low-voltage system designs.
- Package & Mounting: 484-ball BGA in a 484-FPBGA (23x23) supplier package, surface-mount mounting for compact PCB implementation.
- Industrial Temperature Range: Rated for operation from -40 °C to 100 °C for use in industrial environments.
- Regulatory Compliance: RoHS compliant.
Unique Advantages
- High logic integration: 75,264 logic elements and 3,000,000 gates allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
- Substantial on-chip memory: Approximately 0.516 Mbits of embedded RAM for local data buffering and state storage without external memory.
- Extensive I/O resources: 341 I/O pins provide flexibility for interfacing with sensors, peripherals, and external buses.
- Industrial-grade operation: -40 °C to 100 °C temperature rating supports deployment in demanding industrial environments.
- Robust packaging: 484-BGA (484-FPBGA, 23x23) surface-mount package enables high-density, reliable PCB assembly.
- Standards-compliant: RoHS compliance simplifies regulatory considerations for commercial and industrial products.
Why Choose A3PE3000-2FGG484I?
The A3PE3000-2FGG484I positions itself as a high-density, industrial-grade FPGA option for designs that require a large number of logic elements, significant on-chip memory, and a high I/O count in a compact BGA package. Its voltage and temperature specifications make it suitable for controlled low-voltage systems operating across industrial temperature ranges.
Backed by Microchip Technology, this device is appropriate for engineers looking to consolidate logic, memory, and I/O in applications where integration, reliability, and compliance are important considerations.
Request a quote or submit a purchasing inquiry to receive pricing and availability for the A3PE3000-2FGG484I.
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