A3PE3000-2FGG896

IC FPGA 620 I/O 896FBGA
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA

Quantity 770 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O620Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of A3PE3000-2FGG896 – ProASIC3E FPGA, 620 I/O, 896-BGA

The A3PE3000-2FGG896 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It provides a high logic density device with 75,264 logic elements and substantial I/O capability for commercial designs.

With approximately 0.5 Mbits of embedded memory, 3,000,000 gates and 620 user I/O, this surface-mount 896-BGA packaged FPGA is suited to applications requiring dense logic integration and broad interfacing within the commercial temperature range.

Key Features

  • Core Logic: 75,264 logic elements delivering significant programmable logic capacity for complex digital designs.
  • Embedded Memory: Approximately 0.5 Mbits of on-chip RAM (516,096 total RAM bits) to support buffering, state storage and small data structures without external memory.
  • I/O Density: 620 user I/O pins for extensive peripheral and bus connectivity.
  • Gate Count: 3,000,000 gates offering the combinational and sequential resources needed for large designs.
  • Power Supply: Operates from a supply range of 1.425 V to 1.575 V, enabling predictable low-voltage system designs.
  • Package & Mounting: 896-ball BGA (supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for compact board-level integration.
  • Temperature Grade: Commercial grade operation from 0 °C to 85 °C.
  • Environmental Compliance: RoHS compliant.

Unique Advantages

  • High logic integration: 75,264 logic elements and 3,000,000 gates consolidate complex digital functions on a single device, reducing external components.
  • Extensive I/O capability: 620 I/O pins support multiple interfaces and high pin-count connectivity without additional I/O expanders.
  • On-chip memory: Approximately 0.5 Mbits of embedded RAM reduces the need for small external memories and simplifies board layout.
  • Compact BGA package: 896-BGA (31×31) surface-mount package enables a small PCB footprint for space-constrained designs.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product environments.
  • Controlled low-voltage operation: Narrow supply range (1.425 V to 1.575 V) aids predictable power design and voltage management.

Why Choose A3PE3000-2FGG896?

The A3PE3000-2FGG896 positions itself as a high-density, commercially graded FPGA that balances large programmable logic capacity with extensive I/O and on-chip RAM. Its BGA package and surface-mount mounting make it suitable for compact, board-level integration where logic and interface consolidation are priorities.

This device is well suited for designers seeking a single-chip solution to implement complex digital functions with significant I/O requirements while maintaining predictable power and thermal characteristics within the commercial temperature range.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the A3PE3000-2FGG896.

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