A3PE3000-2FGG896
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA |
|---|---|
| Quantity | 770 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 620 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of A3PE3000-2FGG896 – ProASIC3E FPGA, 620 I/O, 896-BGA
The A3PE3000-2FGG896 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It provides a high logic density device with 75,264 logic elements and substantial I/O capability for commercial designs.
With approximately 0.5 Mbits of embedded memory, 3,000,000 gates and 620 user I/O, this surface-mount 896-BGA packaged FPGA is suited to applications requiring dense logic integration and broad interfacing within the commercial temperature range.
Key Features
- Core Logic: 75,264 logic elements delivering significant programmable logic capacity for complex digital designs.
- Embedded Memory: Approximately 0.5 Mbits of on-chip RAM (516,096 total RAM bits) to support buffering, state storage and small data structures without external memory.
- I/O Density: 620 user I/O pins for extensive peripheral and bus connectivity.
- Gate Count: 3,000,000 gates offering the combinational and sequential resources needed for large designs.
- Power Supply: Operates from a supply range of 1.425 V to 1.575 V, enabling predictable low-voltage system designs.
- Package & Mounting: 896-ball BGA (supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for compact board-level integration.
- Temperature Grade: Commercial grade operation from 0 °C to 85 °C.
- Environmental Compliance: RoHS compliant.
Unique Advantages
- High logic integration: 75,264 logic elements and 3,000,000 gates consolidate complex digital functions on a single device, reducing external components.
- Extensive I/O capability: 620 I/O pins support multiple interfaces and high pin-count connectivity without additional I/O expanders.
- On-chip memory: Approximately 0.5 Mbits of embedded RAM reduces the need for small external memories and simplifies board layout.
- Compact BGA package: 896-BGA (31×31) surface-mount package enables a small PCB footprint for space-constrained designs.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product environments.
- Controlled low-voltage operation: Narrow supply range (1.425 V to 1.575 V) aids predictable power design and voltage management.
Why Choose A3PE3000-2FGG896?
The A3PE3000-2FGG896 positions itself as a high-density, commercially graded FPGA that balances large programmable logic capacity with extensive I/O and on-chip RAM. Its BGA package and surface-mount mounting make it suitable for compact, board-level integration where logic and interface consolidation are priorities.
This device is well suited for designers seeking a single-chip solution to implement complex digital functions with significant I/O requirements while maintaining predictable power and thermal characteristics within the commercial temperature range.
Request a quote or submit an inquiry to receive pricing, availability and ordering information for the A3PE3000-2FGG896.

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