A3PE3000-2PQ208I

The A3PE3000-2PQ208I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology, presented in a 208-BFQFP package. It provides a mid-range logic capacity with 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 147 user I/Os for industrial embedded designs.

Designed for applications that require a balance of integration, I/O density, and industrial operating range, this device delivers a compact, surface-mount solution with a defined supply voltage range and wide temperature tolerance.

Key Features

• Core Logic 75,264 logic elements providing substantial capacity for custom digital functions and mid-range designs.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and small embedded data structures.
• Gate Count 3,000,000 gates for logic synthesis and implementation planning.
• I/O Density 147 user I/Os to support a wide variety of external interfaces, sensors, and peripheral connectivity.
• Power Specified supply voltage range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting 208-BFQFP / 208-PQFP (28×28 mm) surface-mount package for PCB assembly in compact layouts.
• Temperature & Grade Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in harsh environments.
• Regulatory RoHS compliant to meet common environmental requirements for electronic assemblies.

Typical Applications

• Industrial Control Systems — Use the device’s industrial temperature rating and I/O count to implement custom control logic and I/O aggregation in factory automation hardware.
• Embedded System Integration — 75,264 logic elements and on-chip RAM allow implementation of custom peripherals, protocol bridging, and glue logic in embedded platforms.
• Prototyping and Development — Mid-range capacity and a standard surface-mount PQFP package make the device suitable for board-level prototyping and design validation.

Unique Advantages

• High Logic Capacity: 75,264 logic elements enable complex custom logic without jumping to larger form factors.
• Meaningful On-Chip Memory: Approximately 0.516 Mbits of embedded RAM supports buffering and local data storage to simplify external memory needs.
• Ample I/O Resources: 147 user I/Os allow flexible interfacing to peripherals, sensors, and I/O headers, reducing external glue logic.
• Industrial Robustness: Rated for -40 °C to 100 °C operation to support deployments in demanding temperature environments.
• Compact Surface-Mount Package: 208-BFQFP / 208-PQFP (28×28) packaging balances I/O density with board-space efficiency for compact designs.
• Standards-Conscious Manufacturing: RoHS compliance supports environmentally constrained product requirements.

Why Choose A3PE3000-2PQ208I?

The A3PE3000-2PQ208I offers a balanced combination of logic capacity, on-chip memory, and I/O density in a compact industrial-grade package from Microchip Technology. Its defined supply voltage window and wide operating temperature range make it suitable for embedded designs that need predictable electrical and thermal behavior.

This part is well suited to teams building mid-range FPGA-based systems that require integration, flexibility, and component-level robustness. It provides a clear upgrade path for designs that need more logic and I/O than small devices, without moving to significantly larger package types.

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