A3PE3000-2PQG208I

The A3PE3000-2PQG208I is a ProASIC3E field programmable gate array (FPGA) offered in a 208-BFQFP surface-mount package. It provides a high-density programmable fabric with 75,264 logic elements and approximately 0.52 Mbits of embedded memory, designed for industrial-grade applications.

With roughly 3,000,000 gates, 147 user I/O pins, and a defined supply voltage range of 1.425 V to 1.575 V, this device is intended for engineers who need a robust, high-capacity FPGA for demanding environments requiring extended temperature operation.

Key Features

• Core Logic  75,264 logic elements delivering substantial programmable fabric for implementing complex digital functions.
• On-chip Memory  Approximately 0.52 Mbits of embedded memory (516,096 bits) to support data buffering, state storage, and intermediate processing.
• Logic Capacity  Approximately 3,000,000 gates providing the raw logic density for medium-to-high complexity designs.
• I/O Resources  147 user I/O pins to accommodate multiple peripherals, buses, and external interfaces on a single device.
• Power Supply  Specified operating supply range of 1.425 V to 1.575 V for the core domain to ensure predictable power requirements.
• Package & Mounting  208-BFQFP (supplier device package: 208-PQFP, 28×28 mm) in a surface-mount form factor for PCB assembly.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C to meet extended-environment requirements.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Systems  Suitable for industrial control and automation designs that require extended temperature operation and robust logic capacity.
• Embedded Logic and Prototyping  Use the 75,264 logic elements and embedded memory to implement custom digital functions, prototypes, and proof-of-concept designs.
• I/O-Intensive Interfaces  147 I/O pins provide connectivity for sensor arrays, control buses, and peripheral interfaces in complex systems.

Unique Advantages

• High Logic Density: The large logic element count enables integration of multiple functions into a single device, reducing board-level component count.
• On-Chip Memory for Data Handling: Approximately 0.52 Mbits of embedded memory supports local buffering and state retention without external memory.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in environments with wide temperature variation.
• Compact Surface-Mount Package: 208-BFQFP surface-mount packaging in a 28×28 footprint simplifies PCB layout for space-constrained designs.
• Predictable Core Power: Defined core supply range (1.425 V–1.575 V) aids power budgeting and system design.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose A3PE3000-2PQG208I?

The A3PE3000-2PQG208I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial programmable logic, on-chip memory, and extended temperature operation. Its combination of 75,264 logic elements, approximately 0.52 Mbits of embedded RAM, and 147 I/O pins makes it well suited for engineers consolidating functions onto a single programmable device.

Engineers and procurement teams seeking a robust FPGA for industrial and embedded deployments will find value in the device’s logic density, predictable power requirements, and surface-mount 208-BFQFP packaging. The part supports long-term design stability and reduced BOM complexity through high integration and compliance with RoHS.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the A3PE3000-2PQG208I.