A3PE3000-FG484I

The A3PE3000-FG484I is a ProASIC3E field programmable gate array (FPGA) designed for industrial-grade embedded applications. It combines high logic density with a substantial I/O count and on-chip memory to support complex custom logic, glue-logic integration, and control functions in industrial environments.

Key Features

• Logic Capacity — 75,264 logic elements providing a total of 3,000,000 gates for implementing complex digital designs and custom IP.
• Embedded Memory — Approximately 0.52 Mbits of on-chip RAM (516,096 bits) to support data buffering, FIFOs, and small on-chip storage requirements.
• I/O Resources — 341 user I/O pins to accommodate broad peripheral interfacing, bus connections, and multi-signal system integration.
• Power and Core Voltage — Manufactured to operate from a core supply range of 1.425 V to 1.575 V, suitable for regulated FPGA core power domains.
• Package and Mounting — 484-ball fine-pitch BGA package (484-FPBGA, 23×23) in a surface-mount configuration for compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet demanding ambient conditions.
• Compliance — RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Use the device for custom logic, protocol bridging, and control functions where high logic density and industrial temperature operation are required.
• Communications Equipment — Implement packet handling, interface adaptation, or custom protocol logic leveraging the large number of I/Os and logic elements.
• Instrumentation and Test — Provide configurable logic and on-chip memory for data capture, preprocessing, and timing-critical signal processing tasks.
• Embedded System Glue Logic — Replace multiple discrete components with a single FPGA to consolidate interfaces, manage peripherals, and implement board-level control.

Unique Advantages

• High logic integration: 75,264 logic elements and 3,000,000 gates allow consolidation of complex functions into a single device, reducing BOM and board area.
• Substantial I/O count: 341 user I/Os enable flexible system interfacing and support for multiple external peripherals and buses.
• On-chip memory: Approximately 0.52 Mbits of embedded RAM supports buffering and local data storage without external memory.
• Industrial-ready thermal range: Rated −40 °C to 100 °C for deployment in challenging ambient environments.
• Compact BGA package: 484-ball FPBGA (23×23) supports dense board layouts and reliable surface-mount assembly.
• Regulatory compliance: RoHS compliance supports modern manufacturing and end-product environmental requirements.

Why Choose A3PE3000-FG484I?

The A3PE3000-FG484I positions itself as a robust, high-density ProASIC3E FPGA option for industrial applications that require significant logic resources, a large number of I/Os, and reliable operation across a wide temperature range. Its combination of approximately 75k logic elements, on-chip memory, and a compact 484-BGA package makes it suitable for designers aiming to consolidate functions and simplify system architecture.

This device is well suited to teams developing industrial control systems, communications hardware, and instrumentation where reprogrammable logic and board-level integration are priorities. The specified electrical and environmental parameters provide a clear basis for designing stable, long-lived solutions.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the A3PE3000-FG484I.