A3PE3000-FG896I

The A3PE3000-FG896I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers substantial logic capacity and I/O density in a compact 896-BGA package for industrial-grade applications.

Key on-chip resources include 75,264 logic elements, approximately 0.52 Mbits of embedded memory, roughly 3,000,000 gates and 620 I/Os. The device operates from 1.425 V to 1.575 V and is specified for an operating range of −40 °C to 100 °C, with surface-mount packaging and RoHS compliance.

Key Features

• Core and Logic Density 75,264 logic elements and approximately 3,000,000 gates provide a high-density programmable fabric for complex digital functions.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM to support buffering, state storage and small lookup tables within the FPGA.
• I/O Capability 620 I/Os enable extensive external connectivity and parallel interfacing to peripherals and subsystems.
• Package and Mounting 896-BGA package (supplier device package: 896-FBGA, 31 × 31 mm) designed for surface-mount assembly in compact boards.
• Power Supply Single-core supply range of 1.425 V to 1.575 V for predictable power budgeting and board-level design.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance RoHS compliant for regulated electronics manufacturing and assembly.

Unique Advantages

• High logic capacity: The large count of logic elements and gates supports complex, integrated digital designs without immediate need for multiple devices.
• Extensive I/O resources: 620 I/Os allow direct connection to many sensors, peripherals and high-pin-count interfaces, reducing external multiplexing.
• On-chip memory: Approximately 0.52 Mbits of embedded RAM simplifies local buffering and control-state storage, lowering external memory requirements.
• Industrial operating range: Specified −40 °C to 100 °C operation suits deployments where extended temperature tolerance is required.
• Compact BGA footprint: 896-FBGA (31 × 31 mm) packaging provides a balance of pin count and board space efficiency for dense system designs.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose A3PE3000-FG896I?

The A3PE3000-FG896I positions itself as a high-density, industrial-grade FPGA option for engineers needing substantial logic and I/O capability in a single device. Its combination of 75,264 logic elements, significant gate count, on-chip memory and broad I/O makes it appropriate for designs that require integration of multiple digital functions while maintaining a compact board footprint.

Designed and manufactured by Microchip Technology, this device offers verifiable electrical and environmental characteristics—including a defined supply voltage window and a −40 °C to 100 °C operating range—that help streamline system-level qualification and long-term deployment in industrial settings.

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