A3PE3000-FGG484I

The A3PE3000-FGG484I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high-density programmable logic fabric with substantial on-chip memory and a large I/O count in a compact 484-BGA footprint.

Designed for industrial applications, the device combines 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 341 I/O to support complex control, interfacing and custom logic functions while operating over a wide temperature and voltage range.

Key Features

• Core Logic  75,264 logic elements provide a high logic capacity suitable for sizeable custom logic implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for buffering, state storage and small data tables.
• I/O Resources  341 I/O pins support extensive peripheral and bus connectivity for multi-interface designs.
• Gate Count  3,000,000 gates for substantial programmable function density.
• Power  Operates from a supply range of 1.425–1.575 V to match tight-system voltage domains.
• Packaging & Mounting  Supplied in a 484-BGA package (484-FPBGA, 23×23) for compact, surface-mount assembly with high pin count.
• Temperature & Grade  Industrial grade device specified for operation from −40 °C to 100 °C for deployments in demanding environments.
• Environmental Compliance  RoHS compliant to support environmentally conscious manufacturing requirements.

Typical Applications

• Industrial Automation: Suitable for control logic, sensor interfacing and protocol bridging where industrial temperature rating and large I/O counts are required.
• Communications & Networking: Use as protocol glue logic, packet processing blocks or interface converters leveraging the high gate and I/O counts.
• Instrumentation & Test Equipment: Implement custom measurement logic, data buffering and I/O aggregation with on-chip RAM and extensive I/O.
• Embedded System Acceleration: Offload specialized functions or implement custom accelerators in designs that require significant logic and memory in a single device.

Unique Advantages

• High Logic Density: 75,264 logic elements and 3,000,000 gates enable complex designs within a single FPGA device.
• Integrated On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage tasks.
• Extensive I/O Capability: 341 I/O pins allow direct connection to numerous peripherals and interfaces, simplifying board design.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in harsh or variable environments.
• Compact High-Pin Package: 484-BGA (23×23) balances high pin count with a compact footprint for dense board layouts.
• RoHS Compliant: Meets environmental compliance requirements for modern manufacturing processes.

Why Choose A3PE3000-FGG484I?

The A3PE3000-FGG484I combines substantial logic capacity, embedded memory and a broad I/O complement in a single industrial-grade FPGA from Microchip Technology. Its packaging and electrical specifications make it suitable for designs that demand dense programmable logic, multiple interfaces and operation across an extended temperature range.

This device is well suited to engineers and teams building industrial control systems, communications modules, instrumentation, and embedded accelerators who need a high-density, compact FPGA with verifiable electrical and environmental specifications.

Request a quote or submit an inquiry for the A3PE3000-FGG484I to obtain pricing and availability information.