A3PE3000-FGG324I

The A3PE3000-FGG324I is a field programmable gate array (FPGA) IC from Microchip Technology designed for industrial-grade applications. It delivers substantial logic capacity and I/O density in a compact 324-ball BGA package, with on-chip memory and low-voltage operation for space- and power-constrained systems.

Key Features

• Logic Capacity  Approximately 75,264 logic elements and 3,000,000 gates provide the programmable fabric needed for complex control, signal processing, and glue-logic implementations.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for buffering, state storage, and small FIFO/ram-based functions.
• I/O Count  221 user I/O pins to support broad interfacing requirements with peripherals, sensors, and external devices.
• Power  Low-voltage core operation with a supply range of 1.425 V to 1.575 V for reduced power consumption and compatibility with low-voltage system rails.
• Package & Mounting  324-ball FBGA (324-FBGA, 19×19) surface-mount package offering a compact footprint for high-density PCB designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions common in industrial deployments.
• Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control Systems  Implement custom control logic, I/O aggregation, and deterministic processing in factory automation and process control equipment.
• Communications & Networking  Provide protocol handling, data buffering, and interface adaptation using the device’s high logic density and large I/O count.
• Test & Measurement Equipment  Enable custom timing, signal conditioning, and real-time data handling in bench and automated test gear.
• Embedded OEM Systems  Integrate multiple functions into a single FPGA for space-constrained OEM products requiring long-term industrial reliability.

Unique Advantages

• High Logic Integration: Large logic element count and gate capacity reduce the need for multiple discrete devices, simplifying system architecture.
• Ample I/O Resources: 221 I/Os enable direct interfacing to a wide range of peripherals and external components without additional multiplexing.
• Compact, Production-Ready Package: 324-FBGA (19×19) surface-mount package supports high-density PCB layouts while maintaining robust electrical connections.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to withstand harsh environments commonly encountered in industrial deployments.
• Low-Voltage Core: Narrow supply range (1.425 V–1.575 V) aligns with modern low-voltage system architectures for efficient power integration.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and end-product requirements.

Why Choose A3PE3000-FGG324I?

The A3PE3000-FGG324I combines substantial programmable logic, on-chip memory, and a high I/O count in a compact 324-BGA package, making it a practical choice for industrial designs that require integration, reliability, and compact form factor. As an industrial-grade FPGA from Microchip Technology, it is suited to engineers and OEMs building control systems, communications gear, test equipment, and embedded systems that demand consistent operation across a wide temperature range.

Its mix of logic capacity, I/O resources, and low-voltage operation supports consolidation of multiple functions into a single device, helping reduce BOM complexity and PCB area while maintaining the flexibility of an FPGA-based design.

Request a quote or contact sales to discuss availability, pricing, and how the A3PE3000-FGG324I can fit into your next industrial FPGA design.