A3PE3000-FGG896I

The A3PE3000-FGG896I is a ProASIC3E field programmable gate array delivering a high logic density and extensive I/O in an industrial-grade package. It provides 75,264 logic elements and approximately 0.52 Mbits of embedded memory, making it suitable for designs that require substantial on-chip logic and memory resources.

With 620 I/O pins, a compact 896-BGA package, and a supply voltage range of 1.425 V to 1.575 V, this device is targeted at applications where integration, robust operating temperature range, and board-level density are important.

Key Features

• Core Logic  75,264 logic elements and 3,000,000 gates provide a substantial programmable fabric for implementing complex logic and custom functions.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM for buffering, state storage, and logic-assisted data handling.
• I/O Capacity  620 general-purpose I/O pins to support wide peripheral interfacing and multi-channel connectivity requirements.
• Package & Mounting  896-BGA package (supplier package: 896-FBGA, 31×31) in a surface-mount form factor for high-density PCB integration.
• Power  Nominal supply voltage range of 1.425 V to 1.575 V to match designs requiring a tightly specified core voltage.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in harsher environments.
• Environmental Compliance  RoHS compliant manufacturing status to support regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control  Implement complex control logic and sensor interfacing using the device's high logic element count and extensive I/O.
• Communications Equipment  Use abundant I/O and on-chip memory to handle protocol bridging, custom packet processing, or interface adaptation.
• Instrumentation & Test  Leverage the dense logic fabric and embedded RAM to build configurable measurement, timing, and data-acquisition functions.

Unique Advantages

• High Logic Density: 75,264 logic elements and 3,000,000 gates enable integration of large amounts of custom logic on a single device, reducing external components.
• Substantial On-Chip Memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and state storage, simplifying system memory architecture.
• Extensive I/O Count: 620 I/O pins provide flexibility for multi-channel interfacing and parallel connectivity without additional IO expanders.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments with wider temperature swings.
• Compact, Surface-Mount Package: 896-BGA (896-FBGA, 31×31) enables high-density PCB layouts while maintaining robust connectivity for complex systems.
• RoHS Compliant: Meets lead-free manufacturing requirements to simplify environmental compliance for assemblies.

Why Choose A3PE3000-FGG896I?

The A3PE3000-FGG896I positions itself as a high-density FPGA option for engineers who need a combination of large logic capacity, ample on-chip memory, and a very high I/O count in an industrial-grade package. Its electrical and thermal specifications support designs that require reliable operation across a broad temperature range and a tightly specified core supply.

This device is well suited to teams developing industrial control systems, communications hardware, and instrumentation where integration, board-level density, and predictable operating conditions deliver long-term value and simplified system designs.

Request a quote or submit an inquiry to receive pricing and availability information for the A3PE3000-FGG896I.