A3PE3000-PQ208

The A3PE3000-PQ208 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It provides a combination of logic density, embedded memory, and I/O in a commercial-grade, surface-mount 208-BFQFP package.

With 75,264 logic elements and approximately 0.516 Mbits of on-chip RAM, this device targets designs that require significant programmable logic and on-chip storage while operating within a 1.425 V to 1.575 V supply window and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity 75,264 logic elements (cells) supporting up to 3,000,000 gates for complex digital implementations.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Resources 147 user I/O pins to consolidate multiple interfaces and external signals within a single device.
• Power Core supply range of 1.425 V to 1.575 V to match specified power-rail requirements.
• Package & Mounting Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for PCB assembly and compact deployment.
• Operating Range Commercial-grade operation from 0 °C to 85 °C.
• Compliance RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Custom Logic Integration Implement complex, application-specific digital logic using the device's 75,264 logic elements and high gate count.
• On-chip Data Handling Use the approximately 0.516 Mbits of embedded memory for data buffering, small tables, or state retention within a single FPGA.
• I/O Consolidation Consolidate multiple peripheral and signal interfaces onto a single device with 147 user I/O pins.
• Commercial Embedded Designs Deploy in commercial-grade systems that operate within a 0 °C to 85 °C range and require RoHS compliance.

Unique Advantages

• High Logic Density: 75,264 logic elements and 3,000,000 gates allow significant on-chip integration, reducing external component count.
• On-chip Memory: Approximately 0.516 Mbits of embedded RAM supports local data storage and reduces external memory dependencies.
• Generous I/O: 147 I/O pins provide flexibility for interfacing with multiple peripherals and external logic.
• Compact Surface-mount Package: 208-BFQFP (208-PQFP, 28×28) enables high-density PCB layouts and standard SMT assembly.
• Commercial-grade Specification: Rated for 0 °C to 85 °C operation and RoHS compliance for deployment in commercial product designs.
• Defined Core Voltage: Operates within a 1.425 V to 1.575 V supply range to match precise power-rail requirements.

Why Choose A3PE3000-PQ208?

The A3PE3000-PQ208 delivers a balance of logic resources, embedded memory, and ample I/O in a single, commercially rated FPGA package from Microchip Technology. Its specification set—75,264 logic elements, approximately 0.516 Mbits of on-chip RAM, 147 I/O, and a 208-BFQFP surface-mount package—suits designs that require substantial programmable logic integration while maintaining compact board footprint and RoHS compliance.

This device is well suited for development teams and procurement groups building commercial embedded systems that need reliable, on-board programmability and defined electrical and thermal operating limits. The combination of logic density, memory, and I/O helps streamline BOMs and consolidate functionality onto one programmable device.

Request a quote or submit a purchase inquiry to get pricing and availability for the A3PE3000-PQ208 today.