A3PE3000L-1FG324

IC FPGA 221 I/O 324FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 221 516096 324-BGA

Quantity 1,242 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O221Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of A3PE3000L-1FG324 – ProASIC3L Field Programmable Gate Array (FPGA) IC 221 516096 324-BGA

The A3PE3000L-1FG324 is a ProASIC3L-series Field Programmable Gate Array from Microchip Technology. It provides a high-capacity, reprogrammable logic fabric packaged in a compact 324-ball BGA.

With 75,264 logic elements, approximately 3,000,000 gates and roughly 0.52 Mbits of embedded memory, this commercial-grade FPGA targets designs that require substantial on-chip logic, memory and I/O density within a 324-FBGA (19×19) surface-mount package. The device operates from a core supply range of 1.14 V to 1.575 V and across a commercial temperature range of 0°C to 85°C.

Key Features

  • Core — Logic Capacity 75,264 logic elements and approximately 3,000,000 gates provide significant programmable logic resources for complex digital designs.
  • Embedded Memory Total on-chip RAM of 516,096 bits (approximately 0.52 Mbits) supports data buffering, FIFOs and small lookup tables without external memory.
  • I/O Density 221 user I/O pins enable broad interfacing options to peripherals, sensors and external devices.
  • Power Core voltage supply range is 1.14 V to 1.575 V, matching the device’s internal power requirements.
  • Package & Mounting 324-ball BGA (supplier package 324-FBGA, 19×19) in a surface-mount form factor for compact PCB integration.
  • Operating Range & Grade Commercial grade with an operating temperature range of 0°C to 85°C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 75,264 logic elements and ~3,000,000 gates provide headroom for complex state machines, datapath logic and custom accelerators.
  • Significant on-chip memory: Approximately 0.52 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage needs.
  • Generous I/O count: 221 I/O pins enable multiple parallel interfaces and flexible board-level connectivity.
  • Compact BGA footprint: 324-FBGA (19×19) lets designers integrate a large FPGA capability into space-constrained PCBs.
  • Defined commercial operating range: Specified 0°C to 85°C operation aligns the device with commercial-grade system requirements.
  • RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose A3PE3000L-1FG324?

The A3PE3000L-1FG324 positions itself as a commercial-grade, high-capacity programmable logic device suitable for designs that require a large number of logic elements, substantial embedded RAM and wide I/O in a compact BGA package. Its specification set—including 75,264 logic elements, approximately 516,096 bits of on-chip RAM and 221 I/O—addresses workloads that need significant on-chip resources without upsizing the board footprint.

Backed by the ProASIC3L documentation from Microchip Technology, this device is appropriate for design teams seeking scalable logic and memory resources within the ProASIC3L family and looking to maintain consistency across commercial embedded applications.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the A3PE3000L-1FG324.

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