A3PE3000L-1FG324I

The A3PE3000L-1FG324I is a ProASIC3L series Field Programmable Gate Array (FPGA) from Microchip Technology, supplied in a 324-ball BGA package. It delivers a balance of programmable logic capacity, embedded memory, and I/O density for industrial-grade designs.

With 75,264 logic elements, approximately 0.516 Mbits of embedded RAM, and 221 general-purpose I/O, this surface-mount FPGA targets designs that require significant gate count and flexible I/O within a 324-FBGA (19×19) package while supporting an industrial operating range.

Key Features

• Logic Capacity  75,264 logic elements and approximately 3,000,000 gates provide substantial on-chip programmable logic for complex custom functions and state machines.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM supports buffering, small lookup tables, and local data storage for accelerated logic operations.
• I/O Resources  221 available I/O pins enable connectivity to sensors, peripherals, and external logic while supporting varied interface requirements.
• Power and Voltage  Operates from 1.14 V to 1.575 V supply rails, allowing design integration with low-voltage systems and regulated power domains.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation, suitable for deployments in industrial environments where wide temperature tolerance is required.
• Package and Mounting  324-BGA / 324-FBGA (19×19) package for high-density, surface-mount PCB implementations.
• RoHS Compliant  Manufactured to meet RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Industrial Control and Automation  Use in control logic and I/O aggregation where the −40 °C to 100 °C operating range and 221 I/O pins accommodate diverse sensor and actuator interfaces.
• Protocol Bridging and Glue Logic  Provision of custom protocol translation and glue logic using the device’s 75,264 logic elements and multiple I/O to implement timing-critical tasks.
• Embedded System Acceleration  Offload compute or deterministic functions to FPGA fabric leveraging the 3,000,000 gates and on-chip RAM for local buffering and state storage.
• Compact High‑Density Designs  Surface-mount 324-FBGA package enables compact board layouts that require a combination of high logic capacity and significant I/O count.

Unique Advantages

• Substantial Logic Density:  75,264 logic elements and roughly 3,000,000 gates enable implementation of complex finite-state machines, custom datapaths, and control logic without external ASICs.
• Embedded RAM for Local Storage:  Approximately 0.516 Mbits of on-chip memory reduces dependency on external RAM for small buffers and LUTs, simplifying board-level design.
• High I/O Count:  221 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA fabric, reducing the need for extra I/O expanders.
• Industrial-Grade Operation:  Rated for −40 °C to 100 °C, the device supports deployment in environments with wide temperature variations common to industrial applications.
• Compact BGA Package:  324-FBGA (19×19) packaging enables dense, surface-mount integration for space-constrained designs while maintaining high I/O and logic capacity.
• Regulatory Compliance:  RoHS compliance supports lead-free manufacturing processes and environmental regulations.

Why Choose A3PE3000L-1FG324I?

The A3PE3000L-1FG324I positions itself as a capable ProASIC3L FPGA solution for projects that require mid-to-high logic density, significant I/O, and industrial temperature operation. Its combination of 75,264 logic elements, approximately 0.516 Mbits of embedded RAM, and 221 I/O pins offers a practical balance of integration and system-level flexibility for industrial and embedded designs.

Backed by Microchip Technology and supplied in a 324-FBGA (19×19) surface-mount package, this device suits applications that demand compact, board-level integration with defined voltage and temperature requirements. Its RoHS compliance and industrial grade enable straightforward incorporation into regulated manufacturing and rugged deployment scenarios.

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