A3PE3000-PQG208I

The A3PE3000-PQG208I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It provides a high-density, industrial-grade programmable logic solution with 75,264 logic elements and approximately 0.52 Mbits of embedded memory.

Built for designs that require substantial on-chip logic, a large I/O count, and extended operating temperature capability, this device targets industrial applications where integration, reliability, and predictable supply requirements are important.

Key Features

• Core Logic  75,264 logic elements and approximately 3,000,000 gates enable complex logic implementations and substantial on-chip fabric for custom digital functions.
• Embedded Memory  Approximately 0.52 Mbits (516,096 bits) of on-chip RAM for buffering, state storage, and small data structures without external memory.
• I/O Capacity  147 I/O pins provide broad interface capability for connecting peripherals, sensors, buses, and other system components.
• Power Supply  Specified voltage supply range of 1.425 V to 1.575 V to match target system power rails and ensure stable device operation within the rated range.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial environments.
• Package & Mounting  Delivered in a 208-BFQFP package (supplier device package 208-PQFP, 28×28) for surface-mount assembly and compact board-level integration.
• Regulatory  RoHS compliant, supporting environmental and materials compliance goals.

Typical Applications

• Industrial Control  Programmable control logic and interface consolidation for industrial equipment, leveraging the device's industrial temperature rating and extensive I/O.
• Embedded System Integration  On-board customization and glue logic in embedded products that require tens of thousands of logic elements and several hundred kilobits of embedded RAM.
• Interface and I/O Aggregation  Protocol bridging, signal multiplexing, and peripheral aggregation where up to 147 I/Os are needed to connect multiple subsystems.

Unique Advantages

• High integration density: The combination of 75,264 logic elements and roughly 3 million gates reduces external components by consolidating logic on-chip.
• Substantial on-chip memory: Approximately 0.52 Mbits of embedded RAM supports buffering and state retention without immediate dependence on external memory devices.
• Large I/O count: 147 I/Os simplify board-level routing for systems that require multiple interfaces or sensor connections.
• Industrial-grade thermal capability: Rated from −40 °C to 100 °C to match demanding environmental conditions encountered in industrial deployments.
• Compact surface-mount package: The 208-BFQFP (208-PQFP, 28×28) enables dense PCB layouts and standard surface-mount assembly processes.
• RoHS compliant: Meets materials compliance expectations for environmentally conscious designs.

Why Choose A3PE3000-PQG208I?

The A3PE3000-PQG208I positions itself as an industrial-grade FPGA option that combines large logic capacity, meaningful embedded memory, and a high I/O count in a compact surface-mount package. Its specified voltage range and extended operating temperature make it suitable for designers needing predictable electrical and thermal behavior.

Engineers and procurement teams looking for a Microchip Technology FPGA with robust logic resources and industrial qualifications will find this device appropriate for designs requiring integration of control, interfacing, and custom digital functions while maintaining board-level density and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability to evaluate the A3PE3000-PQG208I for your next industrial FPGA design.