A3PE3000-PQG208

IC FPGA 147 I/O 208QFP
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

Quantity 894 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of A3PE3000-PQG208 – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

The A3PE3000-PQG208 is a ProASIC3E family Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a high-density programmable logic fabric with substantial on-chip memory and I/O to support complex system integration.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 147 I/O pins and a 3,000,000-gate equivalent, this surface-mount FPGA in a 208-BFQFP package is suited to designs that require significant logic capacity and compact packaging within a commercial temperature range.

Key Features

  • Logic Capacity  75,264 logic elements provide a high level of configurable logic for implementing complex digital functions and control logic.
  • Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
  • I/O Count  147 general-purpose I/O pins to interface with external devices, sensors, and peripherals.
  • Gate Equivalent  3,000,000 gates of logic density to support large-scale integration of custom digital functions.
  • Power and Supply  Operates from a nominal supply range of 1.425 V to 1.575 V, enabling predictable board-level power design.
  • Package and Mounting  Supplied in a 208-BFQFP surface-mount package (supplier package: 208-PQFP, 28×28 mm) for compact board implementations.
  • Operating Temperature  Commercial-grade operation from 0 °C to 85 °C for standard ambient environments.
  • RoHS Compliant  Device meets RoHS environmental compliance requirements.

Typical Applications

  • Custom Digital Control  Implement state machines, protocol handlers, and application-specific control logic using the device’s 75,264 logic elements and 147 I/O pins.
  • High-Density Logic Integration  Consolidate multiple discrete functions or glue logic into a single FPGA thanks to the 3,000,000-gate equivalent capacity.
  • Data Buffering and Local Storage  Use the approximately 0.516 Mbits of embedded RAM for buffering, FIFOs, or small lookup tables within data-path designs.

Unique Advantages

  • High Logic Density: 75,264 logic elements and a 3,000,000-gate equivalent enable integration of large logic functions in one device, reducing board-level component count.
  • Ample I/O Count: 147 I/O pins allow flexible interfacing with multiple peripherals and external devices without additional multiplexing hardware.
  • Compact Surface-Mount Package: The 208-BFQFP (28×28 mm supplier PQFP) package provides a balance of pin count and board space for compact designs.
  • Predictable Power Range: A defined supply window of 1.425 V to 1.575 V simplifies power-supply selection and validation.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C operation, appropriate for standard commercial applications and environments.
  • RoHS Compliance: Environmentally compliant construction supports modern manufacturing requirements.

Why Choose A3PE3000-PQG208?

The A3PE3000-PQG208 delivers a high-capacity, commercially rated FPGA option for designers who need substantial logic resources and on-chip memory in a compact surface-mount package. Its combination of 75,264 logic elements, approximately 0.516 Mbits of embedded RAM, and 147 I/Os makes it suitable for consolidating multiple digital functions and simplifying system architectures.

Backed by Microchip Technology’s ProASIC3E family, this device offers predictable power and thermal behavior within the specified operating range, providing a reliable platform for long-term designs that require high logic density and moderate environmental tolerances.

Request a quote or submit an inquiry to obtain pricing, availability, and additional support information for the A3PE3000-PQG208.

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