A3PE3000-FGG896

The A3PE3000-FGG896 is a ProASIC3E Field Programmable Gate Array (FPGA) IC supplied in an 896-FBGA (31×31) package with surface-mount mounting. It provides 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 620 I/Os for designs that require substantial logic capacity and high I/O density.

Operating from a core supply range of 1.425 V to 1.575 V and rated for commercial temperature operation from 0 °C to 85 °C, the device offers a compact, RoHS-compliant programmable logic option for a wide range of commercial electronic applications.

Key Features

• Logic Capacity  Provides 75,264 logic elements (cells) supporting complex programmable logic implementations and moderate gate counts.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, FIFOs, and small data-storage functions within logic designs.
• I/O Density  620 I/O pins enable multi-channel interfacing and extensive peripheral connectivity in a single FPGA package.
• Gate Count  Rated for 3,000,000 gates, supplying a clear indicator of overall logic resource scale for partitioning and integration planning.
• Package & Mounting  896-FBGA (31×31) package, surface-mount mounting type, suitable where a high pin-count BGA form factor is required.
• Power  Core supply range of 1.425 V to 1.575 V to match system power domains and design constraints.
• Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant, supporting regulatory environmental requirements for lead-free manufacturing.

Typical Applications

• High‑I/O Interface Control  Leverage the 620 I/Os to manage multiple parallel interfaces, protocol bridges, or dense connector-based systems.
• Embedded Logic and Glue  Use the 75,264 logic elements to implement custom control logic, timing-critical glue logic, or data-path processing within system designs.
• On‑Chip Buffering  Employ approximately 0.516 Mbits of embedded RAM for buffering, small FIFOs, or temporary data storage in stream-handling applications.

Unique Advantages

• High Logic Density: 75,264 logic elements provide substantial programmable resources for mid‑to‑large designs without external CPLDs or multiple devices.
• Large I/O Count: 620 I/Os reduce the need for external I/O expanders and simplify multi‑lane or multi‑peripheral designs.
• Integrated Memory: Approximately 0.516 Mbits of embedded RAM enables local buffering and state storage, improving throughput and simplifying external memory usage.
• Compact High‑Pin Package: 896-FBGA (31×31) delivers high connection density in a single surface-mount package to conserve board area.
• Defined Power Window: Core voltage range of 1.425 V to 1.575 V supports consistent power budgeting and regulator selection.
• RoHS Compliance: Meets lead‑free manufacturing requirements for environmentally compliant production.

Why Choose A3PE3000-FGG896?

The A3PE3000-FGG896 balances substantial logic resources, embedded memory, and a very high I/O count in a single 896‑FBGA surface‑mount package. Its commercial temperature grade and defined core voltage range make it suitable for a range of commercial electronic designs where integration density and I/O capability are priorities.

This device is well suited to engineers and purchasers looking for a programmable logic solution that consolidates multiple functions—control logic, interfacing, and buffering—into one component, reducing BOM complexity and board-level routing compared with multi-device solutions.

If you would like pricing or availability, request a quote or submit your requirements and a sales specialist will provide a formal quote and lead‑time information.