A3PE3000-FGG324

The A3PE3000-FGG324 is a ProASIC3E Field Programmable Gate Array (FPGA) IC offering 3,000,000 gates and 75,264 logic elements in a 324-ball BGA package. It provides 221 user I/O pins and approximately 0.52 Mbits of on-chip memory for implementing complex digital logic in commercial electronic designs.

Designed for surface-mount assembly, the device operates from a core supply range of 1.425 V to 1.575 V and is specified for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Logic Capacity  75,264 logic elements (LEs) and 3,000,000 gates provide high-density programmable logic resources for complex designs.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM for local data storage and buffering within custom logic.
• I/O Resources  221 user I/O pins enable extensive external device interfacing and system connectivity.
• Power  Core operating voltage range of 1.425 V to 1.575 V supports stable power sequencing and system integration.
• Package and Mounting  324-BGA (supplier device package: 324-FBGA (19×19)) in a surface-mount form factor for compact board-level integration.
• Environmental  Commercial-grade device with operating range 0 °C to 85 °C and RoHS compliance for regulatory compatibility.

Typical Applications

• Embedded Logic and Control  Use the abundant logic elements and on-chip RAM to implement control algorithms, state machines, and custom processing blocks.
• High-Density I/O Systems  221 I/O pins make this FPGA suitable for designs requiring parallel interfaces, sensor arrays, or multiple peripheral connections.
• Data Buffering and Local Memory  Approximately 0.52 Mbits of embedded memory supports local buffering and temporary data storage within custom logic flows.

Unique Advantages

• Substantial Logic Resources: 75,264 logic elements and 3,000,000 gates enable implementation of large, integrated logic functions without external ASICs.
• Significant I/O Count: 221 user I/O pins reduce the need for additional interface components and simplify board-level routing for multi-channel systems.
• Compact BGA Package: 324-BGA (324-FBGA, 19×19) provides a high-pin-count solution in a space-efficient footprint for dense PCB layouts.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant, supporting standard commercial electronic product requirements.
• Surface-Mount Form Factor: Designed for surface-mount assembly to meet modern PCB manufacturing processes.

Why Choose A3PE3000-FGG324?

The A3PE3000-FGG324 delivers a balance of high logic density, substantial I/O resources, and embedded memory in a compact 324-BGA package for commercial electronic designs. Its defined supply and operating temperature ranges, combined with RoHS compliance and surface-mount packaging, make it suitable for system designers seeking a verifiable, high-capacity FPGA building block.

This device is well suited to projects that require integrated programmable logic with many I/O points and on-chip RAM, offering scalability for complex digital implementations while matching standard commercial manufacturing and environmental expectations.

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