A3PE3000-FGG484

The A3PE3000-FGG484 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for applications that require substantial logic capacity and I/O density in a compact BGA package. It combines 75,264 logic elements with approximately 0.516 Mbits of embedded memory and 3,000,000 gates, offering a balanced platform for custom digital logic, high-density interfacing and on-chip data buffering.

Supplied in a 484-FPBGA (23×23) surface-mount package, this commercially graded, RoHS-compliant device operates across a 1.425 V to 1.575 V core supply range and an operating temperature range of 0°C to 85°C.

Key Features

• Logic Capacity  75,264 logic elements (cells) and approximately 3,000,000 gates provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support data buffering, FIFOs and small working storage without external memory.
• I/O Density  341 user I/O pins to support wide parallel interfaces, multiple peripherals or mixed-signal front-end routing.
• Package and Mounting  484-FPBGA (23×23) package case in a surface-mount form factor for compact board-level integration and reliable solder mounting.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match designs targeting that Vcore envelope.
• Operating Range and Grade  Commercial-grade device rated for 0°C to 85°C operation; RoHS-compliant for lead-free assembly.

Typical Applications

• Custom Logic and Control  Systems requiring extensive programmable logic resources—up to 75,264 logic elements—can implement complex state machines and control functions on-chip.
• I/O-Intensive Designs  Applications that need large numbers of external interfaces benefit from the device’s 341 available I/O pins for parallel buses and multiple peripherals.
• On-Chip Buffering and Small Data Stores  Designs that use embedded memory for buffering, FIFOs or temporary storage can leverage approximately 0.516 Mbits of on-chip RAM.
• Compact Board-Level Integration  The 484-FPBGA (23×23) surface-mount package fits applications where board space and package density are important considerations.

Unique Advantages

• High Logic Density: The combination of 75,264 logic elements and 3,000,000 gates enables consolidation of multiple functions into a single FPGA, reducing external component count.
• Significant I/O Capacity: With 341 I/O pins, the device supports broad connectivity options without additional I/O expanders, simplifying system design.
• Integrated Memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for small to moderate buffering needs.
• Compact BGA Packaging: The 484-FPBGA (23×23) package offers a high-pin-count solution in a compact footprint suitable for dense board layouts.
• Commercial Operating Range: Rated for 0°C to 85°C operation and RoHS-compliant to support standard commercial product requirements.

Why Choose A3PE3000-FGG484?

The A3PE3000-FGG484 positions itself as a balanced FPGA option where significant logic resources, a large number of I/Os, and on-chip memory are required within a compact BGA footprint. Its combination of 75,264 logic elements, ~0.516 Mbits of RAM and 341 I/O pins makes it suitable for designers seeking to integrate multiple digital functions and interfaces into a single device while maintaining a commercial-grade operating profile.

This device delivers measurable board-level benefits—reduced external components, consolidated I/O routing and on-chip buffering—while meeting RoHS requirements and typical commercial temperature ranges, supporting medium- to high-density embedded designs.

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