A3PE3000-FG896

The A3PE3000-FG896 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology offered in a 896‑ball BGA package. It provides high-density programmable logic with a commercial-grade operating range and a broad I/O count for complex system integration.

Key on-chip resources include 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 620 I/O pins and an estimated 3,000,000 gates, enabling dense logic implementation within a single surface-mount package. The device is specified for a supply voltage range of 1.425 V to 1.575 V and an ambient operating temperature of 0 °C to 85 °C.

Key Features

• Core Logic  75,264 logic elements provide a high-density fabric for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM supports storage for buffers, FIFOs, and state machines without external memory.
• I/O Capacity  Up to 620 user I/O pins enable broad peripheral connectivity and flexible board-level interfacing.
• Gate Count  An estimated 3,000,000 gates for substantial logic integration within a single FPGA package.
• Power  Device supply operates across a defined range of 1.425 V to 1.575 V, supporting stable core operation within that window.
• Package & Mounting  Available in an 896‑BGA (896‑FBGA, 31 × 31 mm) surface-mount package for compact, high-density PCB assembly.
• Temperature & Grade  Commercial-grade qualification with specified operation from 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Unique Advantages

• High logic density: 75,264 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Significant on-chip memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Extensive I/O availability: 620 I/O pins support rich peripheral and signal interfacing without additional I/O expanders.
• Compact, high‑pin package: The 896‑BGA (31 × 31 mm) package delivers high connectivity in a surface-mount form factor suited to space-constrained designs.
• Commercial temperature range: Rated from 0 °C to 85 °C for applications and environments that require standard commercial-grade operation.
• RoHS compliant: Conforms to RoHS requirements for materials compliance across manufactured assemblies.

Why Choose A3PE3000-FG896?

The A3PE3000-FG896 is positioned for designs that require a high level of on-chip logic, substantial embedded memory, and a large I/O complement within a compact BGA package. Its specified voltage range and commercial temperature rating make it suitable for mainstream electronic products where integration density and board-space efficiency matter.

For engineering teams and procurement evaluating FPGA solutions, this device offers a clear, specification-driven option balancing logic capacity, memory, and I/O in an industry-standard surface-mount BGA footprint, with RoHS compliance for supply-chain compatibility.

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