A3PE3000-FG324I

The A3PE3000-FG324I is a ProASIC3E field programmable gate array (FPGA) offered in a 324-ball BGA package. It delivers a combination of high logic capacity, embedded memory, and a large I/O count suitable for industrial and embedded system designs.

With 75,264 logic elements, approximately 0.516 Mbits of on-chip RAM and 221 user I/Os in a compact 324-FBGA (19×19) footprint, this device is targeted at designs that require significant integration in a surface-mount, industrial-grade component.

Key Features

• Logic Capacity – 75,264 logic elements providing substantial on-chip programmable logic for complex digital functions.
• Embedded Memory – Approximately 0.516 Mbits (516,096 bits) of on-chip RAM to support buffering, state storage, and small data structures without external memory.
• Gate Count – 3,000,000 gates for broad implementation of combinational and sequential logic.
• I/O Count – 221 user I/O pins to interface with peripherals, sensors, and external logic.
• Package and Mounting – 324-BGA package in a 324-FBGA (19×19) supplier device package; surface-mount suitable for compact PCB layouts.
• Power – Core voltage supply range of 1.425 V to 1.575 V for stable operation within specified limits.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C to meet industrial environment needs.
• Regulatory – RoHS compliant.

Typical Applications

• Industrial Control Systems – Use the device’s industrial temperature rating and high logic density for control, sequencing, and data handling in factory automation and equipment control.
• Embedded Processing – Deploy the on-chip memory and large logic element count to implement custom data paths, protocol handling, and glue logic in embedded platforms.
• High‑I/O Interface Designs – Leverage 221 I/Os for systems that require multiple parallel interfaces, sensor arrays, or mixed-signal front-end connections.

Unique Advantages

• High Logic Density: 75,264 logic elements enable integration of complex logic and multiple functions on a single device, reducing board-level components.
• On‑Chip Memory: Approximately 0.516 Mbits of embedded RAM supports local buffering and state machines without immediate dependence on external memory.
• Generous I/O Resources: 221 user I/O pins provide flexibility for interfacing to multiple peripherals and subsystems.
• Industrial Reliability: Specified for −40 °C to 100 °C operation, suitable for demanding environments where extended temperature range is required.
• Compact BGA Packaging: 324-FBGA (19×19) keeps PCB footprint compact while enabling dense pinout for high pin-count designs.
• Regulatory Compliance: RoHS compliance supports use in environments with restricted substance requirements.

Why Choose A3PE3000-FG324I?

The A3PE3000-FG324I positions itself as a robust, industrial-grade FPGA option where a balance of logic capacity, embedded memory and high I/O count is required in a compact surface-mount package. Its specifications make it suitable for engineers designing embedded control, interface-dense systems, and other industrial applications that need reliable on-board programmable logic.

Choosing this device helps consolidate discrete logic and memory needs into a single FPGA, simplifying board design and providing a platform that supports long-term deployment in temperature-challenging environments.

Request a quote or submit an inquiry to receive pricing and availability for the A3PE3000-FG324I.