A3PE3000-2PQG208

The A3PE3000-2PQG208 is a ProASIC3E Field Programmable Gate Array (FPGA) IC designed for commercial-grade programmable logic applications. It integrates a high density of logic elements and on-chip RAM in a 208-pin BFQFP surface-mount package, making it suitable for designs that require compact, reprogrammable digital logic and embedded memory.

With a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, this device targets mainstream embedded systems and electronic products where programmable logic, configurable I/O, and moderate performance are required.

Key Features

• Logic Density — 75,264 logic elements provide the capacity to implement complex custom digital functions and control logic within a single device.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for buffering, state storage, and small data tables without external memory.
• I/O Count — 147 user I/O pins to interface with peripherals, sensors, and external buses.
• Gate Count — 3,000,000 gates for sizable design implementations and moderate system integration.
• Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB-level assembly.
• Power — Operates from a voltage supply range of 1.425 V to 1.575 V to match target system power rails.
• Temperature Grade — Commercial grade operation from 0 °C to 85 °C for general-purpose electronic applications.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Custom Digital Logic — Implement application-specific finite state machines, data-paths, and glue logic where reprogrammability is required.
• Embedded Systems — Integrate control and interface functions with on-chip memory for compact embedded designs.
• I/O Bridging and Protocol Conversion — Use the device’s I/O resources to bridge peripherals or adapt interfaces without large external logic resources.
• Prototyping and Development — Deploy in platform prototypes that require iterative logic updates and verification before production stages.

Unique Advantages

• High Logic Capacity: 75,264 logic elements enable consolidation of multiple discrete functions into a single FPGA, reducing board-level component count.
• On-Chip RAM: Approximately 0.516 Mbits of embedded memory reduces dependence on external memory for moderate buffering and state retention.
• Generous I/O Count: 147 I/O pins support multiple peripheral connections and flexible board partitioning.
• Compact Surface-Mount Package: 208-pin BFQFP in a 28×28 supplier footprint minimizes PCB area while supporting standard SMT assembly.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match mainstream electronic product requirements.
• RoHS Compliance: Facilitates integration into lead-free manufacturing workflows.

Why Choose A3PE3000-2PQG208?

The A3PE3000-2PQG208 balances logic density, embedded memory, and a substantial I/O count in a compact 208-pin BFQFP package, making it well suited for commercial embedded designs that require reconfigurable digital logic and on-chip RAM. Its commercial temperature rating and RoHS compliance support volume product integration and lead-free assembly processes.

This FPGA is a fit for teams looking to consolidate discrete logic, implement custom interfaces, or prototype programmable functionality within a single, surface-mount component backed by Microchip Technology’s ProASIC3E family characteristics.

Request a quote or submit an inquiry to receive pricing and availability information for the A3PE3000-2PQG208. Our team can provide lead-time estimates and help determine fit for your design needs.