A3PE3000-2FGG896I

The A3PE3000-2FGG896I is a Field Programmable Gate Array (FPGA) from Microchip Technology offering 3,000,000 gates and 75,264 logic elements in a high-pin-count BGA package. Designed for industrial applications, the device combines a large logic capacity and substantial embedded memory with a wide operating temperature range for robust embedded system designs.

With 620 I/O pins and approximately 0.52 Mbits of on-chip RAM, this surface-mount FPGA targets applications that require dense I/O, significant logic resources, and industrial-grade environmental tolerance, while operating from a low-voltage supply of 1.425 V to 1.575 V.

Key Features

• Core Logic  3,000,000 gates and 75,264 logic elements provide substantial capacity for complex custom logic, glue logic, and embedded processing functions.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM supports buffering, FIFOs, and small data stores for real-time processing.
• I/O Density  620 I/O pins enable high-density interfacing to peripherals, sensors, and external devices in compact designs.
• Power  Operates from a specified core voltage range of 1.425 V to 1.575 V, suitable for low-voltage system architectures.
• Package and Mounting  Delivered in an 896-BGA package (supplier device package: 896-FBGA, 31×31) for high pin count in a surface-mount form factor.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for demanding environments.
• Regulatory  RoHS compliant to support environmentally conscious designs and global manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the high logic count and industrial temperature range for control systems, sequence logic, and protocol bridging in factory equipment.
• High‑Density I/O Systems  620 I/O pins enable complex sensor aggregation, multiplexing, and I/O expansion in embedded platforms.
• Communications and Networking  Leverage the large logic and memory resources to implement custom packet processing, interfaces, and glue logic for network equipment.
• Test and Measurement  Embedded memory and abundant logic elements support real-time data handling, signal conditioning, and custom timing logic in instrumentation.

Unique Advantages

• High Logic Capacity: 3,000,000 gates and 75,264 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant On-Chip Memory: Approximately 0.52 Mbits of embedded RAM supports data buffering and local storage without immediate need for external memory.
• Extensive I/O: 620 I/O pins allow direct connection to numerous peripherals and interfaces, minimizing the need for external multiplexers or expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust BGA package for reliable performance in harsher environments.
• Compact, High-Pin-Count Package: 896-FBGA (31×31) provides high interconnect density in a surface-mount footprint suitable for space-constrained designs.
• Low-Voltage Operation: Narrow core voltage range (1.425 V to 1.575 V) aligns with low-voltage system power rails for efficient integration.

Why Choose A3PE3000-2FGG896I?

The A3PE3000-2FGG896I positions itself as a high-capacity, industrial-grade FPGA that brings together large logic resources, substantial embedded RAM, and very high I/O density in a single surface-mount BGA package. These attributes make it well suited for embedded systems that require consolidation of complex logic, extensive interfacing, and dependable operation across a wide temperature range.

Backed by Microchip Technology, this device offers designers a route to reduce board-level BOM and streamline system architecture while maintaining the environmental tolerance and pin count needed for demanding industrial and communications applications.

Request a quote or submit an inquiry to receive pricing and availability information for the A3PE3000-2FGG896I from our sales team.