A3PE3000-2FGG324I

The A3PE3000-2FGG324I is a ProASIC3E Field Programmable Gate Array (FPGA) IC designed for embedded digital logic implementations. It provides a balance of logic density, embedded memory, and a high I/O count for industrial applications requiring configurable hardware functionality.

With 75,264 logic elements, approximately 0.516 Mbits of on-chip RAM and 221 I/O pins in a compact 324-BGA package, this device targets designs that need significant programmable logic capacity in a surface-mount form factor while operating across an industrial temperature range.

Key Features

• Core Logic  75,264 logic elements and approximately 3,000,000 gates provide substantial capacity for implementing custom digital functions and complex state machines.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for buffering, state storage, and small data structures required by implemented logic.
• I/O and Package  221 user I/O pins in a 324-BGA package (supplier device package: 324-FBGA, 19×19) enable dense board layouts and versatile interfacing options; surface-mount mounting type.
• Power  Operates from a supply range of 1.425 V to 1.575 V to meet precise core voltage requirements.
• Temperature and Grade  Industrial-grade device rated for operation from -40 °C to 100 °C for use in challenging thermal environments.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control  Implements custom control logic and I/O interfacing where industrial temperature operation and a high pin count are required.
• Communications Equipment  Provides programmable logic capacity and embedded RAM for protocol handling and interface bridging in compact board layouts.
• Custom Embedded Systems  Enables integration of application-specific logic and peripheral aggregation using abundant logic elements and 221 I/Os.

Unique Advantages

• High Logic Capacity:  75,264 logic elements and roughly 3,000,000 gates allow implementation of sizable custom digital designs without external glue logic.
• On-Chip Memory:  Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for small data buffers and state storage.
• Generous I/O Count:  221 I/Os support multiple interfaces and parallel connections, simplifying system integration.
• Compact, Assembly-Ready Package:  324-BGA (324-FBGA, 19×19) surface-mount package enables high-density PCB assembly and optimized board area utilization.
• Industrial Temperature Range:  Rated from -40 °C to 100 °C for reliability in temperature-challenging deployments.
• Regulatory Compliance:  RoHS compliant to support lead-free manufacturing processes.

Why Choose A3PE3000-2FGG324I?

The A3PE3000-2FGG324I delivers a balanced combination of logic density, embedded memory, and I/O resources in a compact 324-BGA package from Microchip Technology. Its industrial temperature rating and RoHS compliance make it suitable for long-lived embedded designs that require configurable hardware and reliable operation across a wide temperature range.

This device is well suited for engineers building systems that need significant programmable logic capacity, a large number of external interfaces, and a compact surface-mount package—providing a scalable platform for custom digital implementations backed by an established manufacturer.

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