A3PE3000-2FGG324

The A3PE3000-2FGG324 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology supplied in a 324‑BGA package. It integrates 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and 3,000,000 gates with 221 user I/O pins.

Designed for surface-mount PCB assembly, this commercial‑grade FPGA operates from a core voltage range of 1.425 V to 1.575 V and is specified for an operating temperature range of 0°C to 85°C. The device is RoHS compliant.

Key Features

• Logic Resources  75,264 logic elements provide substantial on-chip programmable logic for implementing complex digital functions.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for data buffering, state storage, and small memory structures.
• Gate Count  3,000,000 gates to support dense logic and interconnect requirements within a single device.
• I/O Capacity  221 user I/O pins enable broad external connectivity and interfacing options for peripherals and subsystems.
• Power  Core supply specified at 1.425–1.575 V, allowing designers to plan power delivery and sequencing around a defined operating range.
• Package and Mounting  324‑BGA (supplier package 324‑FBGA, 19×19) in a surface‑mount form factor for compact board-level integration.
• Temperature and Grade  Commercial temperature range of 0°C to 85°C, suitable for standard commercial applications.
• Environmental Compliance  RoHS compliant to meet common lead‑free assembly and regulatory requirements.

Unique Advantages

• High logic density: 75,264 logic elements enable implementation of sizable digital functions without external glue logic.
• Integrated memory: Approximately 0.516 Mbits of embedded RAM reduces the need for small external memory components.
• Ample I/O count: 221 I/O pins support multiple interfaces and flexible board partitioning.
• Compact packaging: 324‑BGA (324‑FBGA, 19×19) provides a space‑efficient footprint for high‑density PCB designs.
• Defined power envelope: Narrow core voltage range (1.425–1.575 V) simplifies power-supply selection and sequencing design.
• RoHS compliant: Meets lead‑free assembly requirements for commercial production environments.

Why Choose A3PE3000-2FGG324?

The A3PE3000-2FGG324 combines a high count of logic elements, embedded memory, and a large gate budget with a substantial I/O complement in a compact 324‑BGA package. Its defined core voltage range and commercial temperature rating make it suitable for mainstream electronic designs where on-chip integration and board space efficiency are priorities.

As a member of the ProASIC3E family from Microchip Technology, this FPGA provides a balance of programmable resources and packaging that supports designers seeking consolidated logic, embedded RAM, and flexible I/O in a RoHS‑compliant device.

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