A3PE3000-2FG896

The A3PE3000-2FG896 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology, provided in an 896-ball FBGA package. It delivers a high-density programmable logic resource set with substantial on-chip memory and a large I/O count for designs that require integrated digital logic, memory, and connectivity.

This device targets applications that benefit from significant logic capacity, embedded RAM, and dense I/O, while operating from a 1.425 V–1.575 V supply and within a commercial temperature range.

Key Features

• Core Logic Approximately 75,264 logic elements providing a total of 3,000,000 gates to implement complex digital functions and glue logic.
• On‑Chip Memory Approximately 0.516 Mbits of embedded memory (516,096 total RAM bits) to support buffering, state storage, and local data processing.
• I/O Density 620 user I/O signals for high pin-count interfacing and connectivity to peripherals, sensors, and external interfaces.
• Package & Form Factor 896‑ball FBGA package (896‑BGA) with a 31 × 31 profile suitable for surface-mount PCB assembly where high I/O density and compact footprint are required.
• Power Operates from a supply voltage of 1.425 V to 1.575 V, enabling integration into designs with tightly specified core voltages.
• Thermal & Grade Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial applications.
• Mounting & Compliance Surface-mount device; RoHS compliant for environmentally conscious designs.

Typical Applications

• High‑density programmable logic — Implement complex digital algorithms and custom accelerators using ~75k logic elements and 3,000,000 gates.
• Memory‑assisted processing — Use approximately 0.516 Mbits of embedded RAM for buffering, FIFOs, and local data storage in streaming or packetized systems.
• High‑I/O system control — Leverage 620 I/O to aggregate and interface multiple peripherals, sensors, and external subsystems on a single device.
• Compact board designs — 896‑FBGA package supports dense PCB layouts where board area and high pin count are required.

Unique Advantages

• High logic capacity: Approximately 75,264 logic elements and 3,000,000 gates enable substantial on-chip functionality without external glue logic.
• Integrated memory resources: 516,096 bits of RAM provide local storage to simplify dataflow and reduce dependence on external memory.
• Extensive I/O: 620 user I/O pins support complex system-level interfacing and connectivity options on a single device.
• Space-efficient package: 896‑FBGA (31 × 31) delivers high I/O density in a surface-mount package suitable for compact system layouts.
• Commercial grade operation: Designed for 0 °C to 85 °C operation, aligning with standard commercial product requirements.
• RoHS compliant: Meets RoHS requirements for environmentally regulated product builds.

Why Choose A3PE3000-2FG896?

The A3PE3000-2FG896 packs a large complement of logic elements, substantial embedded memory, and a very high I/O count into an 896‑FBGA package, making it suitable for designers needing dense programmable logic and on‑chip resources in a compact surface-mount form factor. Its specified supply voltage range and commercial temperature rating provide clear integration parameters for system designs.

Backed by Microchip Technology, this device is aimed at customers building scalable, high‑density digital systems that require integrated memory and broad interfacing capability while maintaining compliance with RoHS requirements.

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