A3PE3000-2FG324I

The A3PE3000-2FG324I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial applications. It combines substantial logic capacity, embedded RAM, and a high I/O count in a compact 324-ball BGA package suitable for surface-mount assembly.

This device is targeted at embedded and industrial system designs that require configurable logic, on-chip memory, and broad I/O integration while operating across an extended temperature range and standard supply voltage window.

Key Features

• Core Logic  Provides 75,264 logic elements and approximately 3,000,000 gates for implementing complex digital functions and custom logic architectures.
• Embedded Memory  Includes approximately 0.52 Mbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Capacity  Offers 221 user I/O pins to support multiple interfaces and peripheral connections directly from the FPGA fabric.
• Power  Operates from a VCCINT supply range of 1.425 V to 1.575 V to meet platform power requirements.
• Package & Mounting  Supplied in a 324-BGA package (supplier device package: 324-FBGA, 19×19) and intended for surface-mount assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control  Implement control logic, custom sequencing, and I/O aggregation in factory automation and machine control systems that require industrial temperature capability.
• Embedded Systems  Serve as a programmable logic element for embedded designs needing moderate logic density and on-chip RAM for temporary storage and state machines.
• Interface and I/O Bridging  Provide flexible I/O handling and protocol adaptation between peripherals and system processors using the device’s 221 I/O pins.

Unique Advantages

• High Logic Capacity: 75,264 logic elements and ~3,000,000 gates enable implementation of sizable custom logic blocks without external ASICs.
• On-chip Memory: Approximately 0.52 Mbits of embedded RAM reduces reliance on external memory for buffering and small data structures.
• Substantial I/O Count: 221 I/O pins support multiple peripherals and interfaces, simplifying board-level routing and integration.
• Industrial Ready: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsh environments.
• Compact BGA Package: 324-BGA (324-FBGA, 19×19) balances I/O density and PCB footprint for space-constrained designs.
• Standards Compliance: RoHS compliance aligns with modern manufacturing and environmental requirements.

Why Choose A3PE3000-2FG324I?

The A3PE3000-2FG324I combines a large complement of logic elements, on-chip RAM, and a high I/O count in a compact 324-BGA footprint, making it well suited for industrial and embedded applications that require configurable digital logic and robust operating conditions. Backed by Microchip Technology, this device offers designers a balanced mix of integration and reliability for systems that must operate across an extended temperature range.

Its combination of logic density, memory, I/O capacity, and industrial-grade temperature rating provides long-term value for projects that need scalable programmable logic with clear physical and electrical specifications.

Request a quote or submit an inquiry to our sales team to check availability, pricing, and lead times for the A3PE3000-2FG324I.