A3PE3000-2FG484

The A3PE3000-2FG484 is a ProASIC3E field programmable gate array from Microchip Technology, delivered in a 484‑BGA surface mount package. It provides a reconfigurable logic platform with a high logic element count, broad I/O capability and on-chip memory for commercial embedded designs.

With up to 3,000,000 gates, 75,264 logic elements, approximately 0.52 Mbits of embedded memory and 341 I/O pins, this device targets applications that need high logic density and significant I/O integration while operating within a 1.425 V to 1.575 V core supply window and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity — 75,264 logic elements supporting a design complexity up to 3,000,000 gates for dense digital implementations.
• Embedded Memory — Approximately 0.52 Mbits of on-chip RAM for buffering, state storage and memory-mapped logic functions.
• I/O Density — 341 I/O pins to support extensive peripheral connectivity and high‑pin-count system designs.
• Power Supply — Core voltage range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting — 484‑BGA (23 × 23) surface-mount package for compact board-level integration and high pin density.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard embedded environments.
• Compliance — RoHS compliant to support lead‑free assembly requirements.

Typical Applications

• Custom digital systems — Implement complex, high‑density logic functions using the device’s large logic element count and gate capacity.
• I/O‑intensive interfaces — Aggregate and manage multiple parallel interfaces or high‑pin peripheral sets with 341 available I/Os.
• Embedded control and buffering — Use on‑chip RAM for local buffering and state machines in control applications.
• Compact board-level solutions — The 484‑BGA surface‑mount package enables high integration in space-constrained commercial products.

Unique Advantages

• High logic density: 75,264 logic elements and 3,000,000 gates provide headroom for complex custom logic without multiple devices.
• Substantial I/O count: 341 I/O pins reduce the need for external multiplexing and simplify board routing for multi‑interface systems.
• On‑chip memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and reduces dependency on external memory.
• Compact package: 484‑BGA (23 × 23) delivers high pin density in a small footprint for space-limited designs.
• Regulatory readiness: RoHS compliance supports lead‑free assembly and environmental requirements.
• Commercial temperature rating: Designed for standard commercial environments with operation from 0 °C to 85 °C.

Why Choose A3PE3000-2FG484?

The A3PE3000-2FG484 is positioned for commercial embedded designs that require a balance of high logic capacity, broad I/O connectivity and on‑chip memory in a compact package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of RAM and 341 I/Os makes it suitable for integrating complex digital functions while reducing external component count.

Backed by Microchip Technology and delivered in a surface‑mount 484‑BGA package with RoHS compliance, the A3PE3000-2FG484 offers a practical option for designers seeking scalable, high‑density FPGA capability within commercial temperature and supply constraints.

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