A3PE3000-2FGG484

The A3PE3000-2FGG484 from Microchip Technology is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) designed for commercial embedded designs. It provides a high-density logic fabric with substantial on-chip memory and a large number of I/O pins to support I/O-dense and integration-focused applications.

With 75,264 logic elements and approximately 0.516 Mbits of embedded memory, this device targets systems that require significant programmable logic, on-chip RAM, and a compact 484-BGA surface-mount package.

Key Features

• Logic Capacity — 75,264 logic elements delivering a programmable fabric suitable for complex glue logic, protocol handling, and custom hardware functions.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM for buffering, state storage, and small-data processing tasks without external memory.
• Gate Scale — 3,000,000 gates providing additional measure of integration for multi-function designs.
• I/O Density — 341 I/O pins to support lots of external interfaces, sensors, and peripheral connections on a single device.
• Power Supply — Operates from a supply range of 1.425 V to 1.575 V, enabling clear power planning for the core domain.
• Package & Mounting — 484-BGA (supplier device package: 484-FPBGA 23×23) in a surface-mount form factor for compact PCB integration.
• Operating Conditions — Commercial grade with an operating temperature range of 0°C to 85°C for standard commercial environments.
• Compliance — RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• Embedded Control Systems — Use the device for integrating control logic and peripheral interfaces where a high count of I/O and programmable logic are required.
• Protocol Bridging and Glue Logic — Implement protocol conversion, bus bridging, and custom interface logic using the available gates and logic elements.
• Data Buffering and Processing — Leverage the on-chip RAM for temporary data storage, buffering, and small-scale data processing tasks.
• Board-Level Integration — Consolidate multiple discrete functions into a single FPGA to reduce BOM and simplify PCB routing in compact designs.

Unique Advantages

• High Logic Integration: 75,264 logic elements and 3,000,000 gates allow consolidation of multiple functions into one device.
• Ample I/O: 341 I/O pins support dense external connectivity and reduce the need for external multiplexers or expanders.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM enable local buffering and state storage without external memory chips.
• Compact, Surface-Mount Package: 484-BGA (484-FPBGA, 23×23) provides a high-pin-count solution in a compact footprint for space-constrained PCBs.
• Commercial Temperature Range: Rated 0°C to 85°C for standard commercial applications and environments.
• RoHS Compliant: Supports lead-free manufacturing processes for regulatory and assembly requirements.

Why Choose A3PE3000-2FGG484?

The A3PE3000-2FGG484 positions itself as a high-density, commercially rated FPGA for designs that require a combination of substantial logic capacity, significant I/O, and on-chip memory in a compact BGA package. It is suited to engineers seeking to consolidate board-level functions, implement custom protocol logic, or add programmable intelligence to embedded systems.

Backed by Microchip Technology, this part offers a balance of integration and practical operating parameters—making it appropriate for commercial embedded products where space, I/O count, and integrated memory are primary design considerations.

Request a quote or contact sales to check pricing and availability for the A3PE3000-2FGG484 and to discuss lead times or volume options.