A3PE3000-PQ208I

IC FPGA 147 I/O 208QFP
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

Quantity 54 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O147Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of A3PE3000-PQ208I – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

The A3PE3000-PQ208I is a ProASIC3E field programmable gate array (FPGA) providing a high-density logic fabric with on-chip memory and extensive I/O. It targets designers who need reconfigurable digital logic capacity packaged for surface-mount assembly and industrial-temperature operation.

Key attributes include 3,000,000 gates, 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 147 user I/Os, and a 208-pin BFQFP/PQFP package, with RoHS compliance and an industrial operating temperature range.

Key Features

  • Core Logic 3,000,000 gates and 75,264 logic elements provide substantial programmable logic capacity for complex designs.
  • Embedded Memory Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and embedded data processing.
  • I/O and Interfacing 147 user I/Os enable broad connectivity to peripherals, interfaces, and external devices.
  • Power Nominal supply range of 1.425 V to 1.575 V for the core supply, allowing predictable power budgeting within the specified window.
  • Package and Mounting Available in a 208-BFQFP package (supplier device package listed as 208-PQFP, 28×28) designed for surface-mount PCB assembly.
  • Temperature and Grade Industrial-grade device with an operating temperature range of –40 °C to 100 °C for deployment in thermally demanding environments.
  • Compliance RoHS-compliant construction supports regulatory and environmental requirements.

Typical Applications

  • Custom digital logic and prototyping Programmable fabric and abundant logic elements make the device suitable for implementing custom digital functions and hardware prototypes.
  • I/O-intensive interfacing With 147 I/Os, the device supports designs that require extensive external connectivity and signal routing.
  • Embedded memory applications Approximately 0.516 Mbits of on-chip RAM can be used for buffering, small data stores, and real-time processing tasks.
  • Industrial control systems Industrial-grade temperature range and surface-mount packaging support deployment in industrial electronics and control equipment.

Unique Advantages

  • High logic density: 3,000,000 gates and 75,264 logic elements enable complex designs and feature integration on a single device.
  • Ample on-chip memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
  • Large I/O count: 147 I/Os simplify board-level routing and integration with peripherals, reducing the need for additional interface components.
  • Industrial-ready thermal range: Rated for –40 °C to 100 °C to meet the demands of industrial applications.
  • Surface-mount 208-pin package: BFQFP/PQFP 208-pin footprint supports compact PCB layouts and standard assembly processes.
  • Regulatory compliance: RoHS-compliant manufacturing aligns with environmental and material requirements.

Why Choose A3PE3000-PQ208I?

The A3PE3000-PQ208I positions itself as a high-capacity, industrial-grade FPGA option for designers needing significant programmable logic, embedded memory, and extensive I/O in a surface-mount 208-pin package. Its combination of 3,000,000 gates, 75,264 logic elements, and support for an extended temperature range makes it suitable for demanding embedded and control applications.

Choose this device for designs that require scalable logic resources, on-chip RAM for local data handling, and a robust operating envelope—backed by RoHS-compliant manufacturing and packaging options that integrate into standard PCB assembly flows.

Request a quote or submit an inquiry to receive pricing and availability for the A3PE3000-PQ208I.

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